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Copper film formation using electron cyclotron resonance plasma sputtering and reflow method
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10.1116/1.589256
/content/avs/journal/jvstb/15/1/10.1116/1.589256
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/15/1/10.1116/1.589256
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/content/avs/journal/jvstb/15/1/10.1116/1.589256
1997-01-01
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Copper film formation using electron cyclotron resonance plasma sputtering and reflow method
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/15/1/10.1116/1.589256
10.1116/1.589256
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