Schematic illustration of the fabrication of element microtip arrays in silicon substrate using photolithography, thermal shaping, argon ion beam etching, and sputtering deposition. (A) Photolithography; (B) fabrication of photoresist mask; (C) thermal shaping and consolidation; (D) ion beam etching; (E) silicon microtip; (F) ion beam sputtering and materials depositing; and (G) field emission device.
SEM photographs of the square-bottom and circle-bottom circle-microtip arrays in silicon substrate. (A) Outline of silicon pattern. (B) Distribution of microparticles on silicon samples.
Rough surfaces of silicon samples fabricated.
SEM photographs of samples fabricated. (A) Photoresist pattern with basic square-bottom arch structure; (B) square-bottom pyramid-shaped silicon microtip array.
SEM photographs of samples fabricated. (A) Photoresist pattern with basic circle-bottom spherical structure; (B) cone-shaped silicon microtip array.
Relation between the sharpness of the silicon microtip and argon ion beam energy.
Field emission characteristics of the fabricated devices with cone-shaped microtip structure and pyramid-shaped microtip structure in low current range.
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