1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Comparative study of polycrystalline Ti, amorphous Ti, and multiamorphous Ti as a barrier film for Cu interconnect
Rent:
Rent this article for
USD
10.1116/1.1852466
/content/avs/journal/jvstb/23/1/10.1116/1.1852466
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/23/1/10.1116/1.1852466
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

X-ray diffraction pattern of as-deposited PVD-Ti, CVD-Ti, and films.

Image of FIG. 2.
FIG. 2.

Cross-sectional STEM micrographs of PVD-Ti.

Image of FIG. 3.
FIG. 3.

Cross-sectional STEM micrographs of (a) CVD-Ti and (b) plasma-treated Ti films.

Image of FIG. 4.
FIG. 4.

Resistivity of film as a function of plasma-treatment time.

Image of FIG. 5.
FIG. 5.

Variation in sheet resistance of Cu/barrier/Si as a function of annealing temperature.

Image of FIG. 6.
FIG. 6.

XRD spectra of Cu/barrier/Si samples after annealing at (a) 500, (b) 600, and (c) 650 and , respectively.

Image of FIG. 7.
FIG. 7.

SEM micrograph of -annealed sample. Cu film is stripped after annealing.

Image of FIG. 8.
FIG. 8.

Variation in leakage current density of Cu/barrier/Si as a function of annealing temperature.

Image of FIG. 9.
FIG. 9.

Cross-sectional TEM micrographs of (a) -annealed , (b) -annealed , (c) -annealed , and (d) high-resolution TEM image of the annealed .

Image of FIG. 10.
FIG. 10.

Schematic illustrations of the microstructure of (a) , (b) and, (c) samples before and after annealing.

Loading

Article metrics loading...

/content/avs/journal/jvstb/23/1/10.1116/1.1852466
2005-01-14
2014-04-18
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Comparative study of polycrystalline Ti, amorphous Ti, and multiamorphous Ti as a barrier film for Cu interconnect
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/23/1/10.1116/1.1852466
10.1116/1.1852466
SEARCH_EXPAND_ITEM