Typical load-displacement curves obtained for (solid line) and (dashed line) structures from four-point bend tests. Structures with APTMS show a higher load plateau than those with TMSEP.
XPS spectra of N obtained from APTMS (solid line) and TMSEP (dashed line) MNLs formed using (a) and (b) solutions.
Ellipsometry measurement of thickness as a function of APTMS and TMSEP concentration for films formed from (open squares) and solutions (open circles). The theoretical thickness (filled triangles) is shown for reference.
Interfacial debonding energies of APTMS and TMSEP prepared from 5 and solutions compared with that of the control sample.
XPS spectra from fracture surfaces of (a) and (b) structures showing N peaks only on the side. Insets show high resolution scans in the vicinity of the N band. Dashed curves correspond to Cu fracture surface and solid lines correspond to fracture surface.
Structure of MNLs used in our study.
Equilibrium contact angles for TMSEP and APTMS MNLs formed from solutions of different concentrations.
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