Cross beam lithography and dip pen nanolithography for nanoparticle conductivity measurements
SEM images of the gold pattern made by a combination of optical and e-beam lithography.
SEM images of pattern obtained using different FIB milling time; (a) gaps between using , (b) using and those with a thin gold wire branching the gap (c), using just . All 3 types of gaps were obtained with a good repeatability.
(a) AFM image of the tips of the structure of Fig. 2(b) showing the narrow gap of about . (b) AFM image (height and phase) of a smaller gap obtained from the samples of Fig. 2(c).
curves, showing a tenfold increase in conductivity (with respect to the conductivity of the preassembled gap) after assembly of diameter Au nanoparticles coated with hexanethiol (HT) and MUD ligands and mixed with the di-isocyanate molecule; the particles were patterned with dip pen nanolithography. The curves were linear from .
After the assembly of a diameter Au nanoparticle by DPN, this device showed a 100-fold increase in conductivity with respect to the preassembled gap; the curves shown were taken before and after nanoparticle deposition. Measuring the device again later, almost no change in conductivity was observed, demonstrating a strong, stable covalent bond.
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