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Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks
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10.1116/1.2210003
/content/avs/journal/jvstb/24/4/10.1116/1.2210003
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/24/4/10.1116/1.2210003
/content/avs/journal/jvstb/24/4/10.1116/1.2210003
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/content/avs/journal/jvstb/24/4/10.1116/1.2210003
2006-06-29
2014-09-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/24/4/10.1116/1.2210003
10.1116/1.2210003
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