(a) Cross-sectional view of a YBCO microbolometer. CoventorWare® model of the micromachined microbolometers showing (b) the -long electrode arm geometry for the frame rate and (c) the -long electrode arm geometry for the frame rate.
(a) Fabrication started with the CMOS readout die bonded to silicon carrier wafer. (b) Aluminum deposition. Shown in a CoventorWare® schematic, a single microbolometer pixel, and a array. (c) Sacrificial polyimide PI2737 coating and patterning for frame rate shown for the same series of photos. (d) Titanium deposition and patterning to form the -long electrode arms with the same series of photos.
Microbolometer fabrication continued using a Coventorware® schematic, image of a single microbolometer pixel, and a array. (a) Gold contact deposition and patterning. (b) YBCO thermometer deposition and patterning. (c) Sacrificial polyimide ashing to complete the microbolometer fabrication process.
SEM micrograph of a portion of a microbolometer array with a CTIA readout circuit.
Current-voltage characteristic of (a) two NMOS transistors and (b) two PMOS transistors before and after microbolometer fabrication showing vs characteristics.
dc transfer characteristic showing the output voltage vs input voltage for (a) the CTIA amplifier and (b) the CCBDI amplifier measured before and after microbolometer fabrication.
(a) Resistance and TCR vs temperature and (b) Arrhenius plot showing natural logarithm of microbolometer resistance vs .
characteristic of four YBCO microbolometers for a -long electrode arm geometry.
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