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Evaluation of new materials for plasmonic imaging lithography at using near field scanning optical microscopy
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Image of FIG. 1.
FIG. 1.

Evaluation of conductors for plasmonic imaging lithography. The metal with the highest material quality factor, silver, has a peak at , corresponding to optimal exposure wavelengths of .

Image of FIG. 2.
FIG. 2.

Optical micrograph of the patterning step as the resist is exposed.

Image of FIG. 3.
FIG. 3.

(a) AFM image of the sample postdevelopment. The patterns were exposed at scan speeds of 4, 8, and . The patterns become less defined as the dose is decreased from left to right, indicating a lower degree of cross-linking in the respective regions. (b) Three-dimensional AFM image of the well-defined line patterned at with cross-sectional analysis. The line has a FWHM of and a height of

Image of Scheme 1.
Scheme 1.

Preparation of polymer 2, poly(4-methacrylmethyl styrene).

Image of Scheme 2.
Scheme 2.

Mechanism of photoinduced cross-linking of the resist system. Excitation of camphorquinone at followed by hydrogen abstraction from dimethylaniline initiates polymerization of poly(4-methacrylmethyl styrene) in the film, forming insoluble material in the exposed region.


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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Evaluation of new materials for plasmonic imaging lithography at 476nm using near field scanning optical microscopy