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Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect
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10.1116/1.2823054
/content/avs/journal/jvstb/26/1/10.1116/1.2823054
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/26/1/10.1116/1.2823054

Figures

Image of FIG. 1.
FIG. 1.

Film stacks of four-point bending adhesion sample of (a) SiCO/Cu and (b) SiCO/low .

Image of FIG. 2.
FIG. 2.

Copper surface morphology: (a) ammonia plasma treatment, (b) hydrogen plasma treatment, (c) hydrogen plasma treatment and silane soak, and (d) hydrogen plasma treatment, silane soak, and postammonia plasma treatment.

Image of FIG. 3.
FIG. 3.

XPS of copper surface after (a) hydrogen plasma treatment and silane soak (Con_C), and (b) hydrogen plasma treatment, silane soak, and post ammonia plasma treatment (Con_D).

Image of FIG. 4.
FIG. 4.

SiCO films’ surface morphology: (a) ammonia plasma treatment, (b) hydrogen plasma treatment, (c) hydrogen plasma treatment and silane soak, and (d) hydrogen plasma treatment, silane soak, and postammonia plasma treatment.

Image of FIG. 5.
FIG. 5.

Debonding energy of different treatment conditions for (a) copper/SiCO film and (b) low /SiCO film.

Image of FIG. 6.
FIG. 6.

SEM micrographs of the fracture surface of (a) copper/SiCO film and (b) low /SiCO interface.

Image of FIG. 7.
FIG. 7.

Schematic of fracture interfaces of different treatments: (a) Con_A, (b) Con_C, and (c) Con_D. characteristics of SiCOF and SiCO films.

Image of FIG. 8.
FIG. 8.

Cu wire resistance distribution of a comb structure with for different pretreatments with a cap layer SiCO film.

Image of FIG. 9.
FIG. 9.

Breakdown voltage distribution of a comb structure with for different pretreatments with a cap layer SiCO film.

Tables

Generic image for table
TABLE I.

Pretreatment conditions and steps.

Generic image for table
TABLE II.

Plasma treatment conditions and roughness summary on Cu surface.

Generic image for table
TABLE III.

Bond energy of typical molecules.

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/content/avs/journal/jvstb/26/1/10.1116/1.2823054
2008-01-04
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/26/1/10.1116/1.2823054
10.1116/1.2823054
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