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Direct UV-imprint lithography using conductive nanofiller-dispersed UV-curable resin
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10.1116/1.2953731
/content/avs/journal/jvstb/26/4/10.1116/1.2953731
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/26/4/10.1116/1.2953731
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Master pattern design for the Ag nanoparticle-mixed UV-curable resin (electrode widths: 50, 100, 150, and ; lengths: 1, 2, and ).

Image of FIG. 2.
FIG. 2.

Substrate coating and UV imprint using roll pressure for the direct patterning of high viscous Ag colloid-based UV-curable resist.

Image of FIG. 3.
FIG. 3.

UV-imprinted results with nanosilver-loaded UV-curable resin. (a) Center of electrode and (b) region of electrode pad.

Image of FIG. 4.
FIG. 4.

UV-imprinted results with nanosilver-loaded UV-curable resin. (a) Center of electrode and (b) region of electrode pad.

Image of FIG. 5.
FIG. 5.

Pattern reductions at each process step (imprinting, heat treatment, and wet etching) for Ag-loaded resin. The dimensional variations of the as-imprinted patterns wide and high reached and , respectively, in the finalized patterns.

Image of FIG. 6.
FIG. 6.

Finalized electrode structures after wet etching to remove imprint residue. Etch defects such as residual etchant and unetched nanosilver fragments still remain before additional cleaning.

Image of FIG. 7.
FIG. 7.

Resistivity measurements in terms of Ag concentrations.

Image of FIG. 8.
FIG. 8.

Pattern surfaces selectively dry etched using ME-RIE.

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/content/avs/journal/jvstb/26/4/10.1116/1.2953731
2008-08-12
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Direct UV-imprint lithography using conductive nanofiller-dispersed UV-curable resin
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/26/4/10.1116/1.2953731
10.1116/1.2953731
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