Schematic of the proposed rf switch. (a) The 3D image of the proposed rf switch. (b) A top view of the bottom electrode and the back side view of the membrane. (c) 3D image of each layer. (d) area cross sectional view of the proposed rf switch.
Simplified operating mode of the proposed rf MEMS switch. (a) The initial off state. (b) The on state. (c) The seesaw mode off state of the MEMS switch.
rf simulated results of the purposed switch.
Fabrication process for the proposed MEMS switch. (a) Signal line and electrodes formation. (b) Cavity formation. (c)Insulation layer formation. (d) Pivot and contact pad formation. (e) Glass and silicon wafer bonding. (f) Membrane formation.
SEM image for the fabricated MEMS switch. (a) The side view of fabricated MEMS switch. (b) Detail view of MEMS switch.
rf characteristics of the simulated and fabricated rf switch.
Fabrication parameters of the proposed rf switch.
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