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Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low- interconnects by using etching
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10.1116/1.3100268
/content/avs/journal/jvstb/27/2/10.1116/1.3100268
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/2/10.1116/1.3100268
/content/avs/journal/jvstb/27/2/10.1116/1.3100268
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/content/avs/journal/jvstb/27/2/10.1116/1.3100268
2009-03-20
2014-09-22
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low-k interconnects by using CF3I etching
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/2/10.1116/1.3100268
10.1116/1.3100268
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