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Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
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10.1116/1.3071855
/content/avs/journal/jvstb/27/3/10.1116/1.3071855
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/3/10.1116/1.3071855
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic diagram of chip formation in ductile cutting of silicon wafers.

Image of FIG. 2.
FIG. 2.

Schematic diagrams of the maximum undeformed chip thickness.

Image of FIG. 3.
FIG. 3.

Illustration of the effect of the compressive stress on the cutting region.

Image of FIG. 4.
FIG. 4.

SEM photograph of the crack-free machined silicon wafer surface .

Image of FIG. 5.
FIG. 5.

AFM photographs of the machined silicon wafer surfaces with free of cracks: (a) and (b) .

Image of FIG. 6.
FIG. 6.

Cross-section view of the machined silicon wafer achieved in ductile mode cutting.

Image of FIG. 7.
FIG. 7.

TEM picture of chips generated under ductile mode cutting of silicon wafer.

Image of FIG. 8.
FIG. 8.

SEM picture of chips generated under ductile mode cutting of silicon wafer.

Image of FIG. 9.
FIG. 9.

Machined surface profile of silicon wafer achieved in ductile mode cutting.

Image of FIG. 10.
FIG. 10.

Machined surface roughness of on silicon wafers.

Image of FIG. 11.
FIG. 11.

Diamond tool wear occurred at the flank face.

Image of FIG. 12.
FIG. 12.

Digital photo of ductile mode cutting surface of silicon wafer.

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/content/avs/journal/jvstb/27/3/10.1116/1.3071855
2009-05-26
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/3/10.1116/1.3071855
10.1116/1.3071855
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