Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
Schematic diagram of chip formation in ductile cutting of silicon wafers.
Schematic diagrams of the maximum undeformed chip thickness.
Illustration of the effect of the compressive stress on the cutting region.
SEM photograph of the crack-free machined silicon wafer surface .
AFM photographs of the machined silicon wafer surfaces with free of cracks: (a) and (b) .
Cross-section view of the machined silicon wafer achieved in ductile mode cutting.
TEM picture of chips generated under ductile mode cutting of silicon wafer.
SEM picture of chips generated under ductile mode cutting of silicon wafer.
Machined surface profile of silicon wafer achieved in ductile mode cutting.
Machined surface roughness of on silicon wafers.
Diamond tool wear occurred at the flank face.
Digital photo of ductile mode cutting surface of silicon wafer.
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