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Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
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10.1116/1.3071855
/content/avs/journal/jvstb/27/3/10.1116/1.3071855
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/3/10.1116/1.3071855
/content/avs/journal/jvstb/27/3/10.1116/1.3071855
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/content/avs/journal/jvstb/27/3/10.1116/1.3071855
2009-05-26
2014-07-22
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/27/3/10.1116/1.3071855
10.1116/1.3071855
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