Overall process flow for fabrication of the metal pattern using bilayer UV-NIL and lift-off process.
Photograph of the imprinted resist patterns on the PVA-coated Si substrate using M-PDMS-based UV-curable imprint resin (A) without and (B) with methacryl-oxypropyl-trichlorosilane as an adhesion promoter. [(1) imprinted pattern; (2) region where patterns were detached from the substrate]
(A) Cross-sectional and (B) top-down SEM images of the quartz template, and (C) cross-sectional and (D) top-down SEM images of the imprinted resist pattern.
Cross-sectional SEM images after RIE with rf power of (A) , (B) , and (C) and top-down SEM image after RIE with rf power of . (Etch time is fixed at , the symbol “I” in figures is the height of initial imprinted pattern.)
(A) Top-down and (B) cross-sectional SEM images of Ti patterns after the lift-off process.
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