(Color online) Process route for fabrication of hybrid daughter stamps and replication in thermoplastic material: [(a)–(c)] Fabrication of first generation daughter stamp from silicon master (zeroth generation), (d) optional copying of second generation daughter stamp, [(e)–(h)] combined thermal and UV-NIL in spin coated resist.
Scanning electron microscopy micrographs from cross sections of RIE etched master stamp with 47 nm depth, period of 76 nm, linewidth of 20 nm, and HSQ resist left after etching (initial thickness 60 nm).
Imprints of 35 nm half-pitch structures into different thermoplastic resists: structures in mr-NIL 6000.3 (top) are well replicated, in mr-I 7030 (center) they are slightly rounded, and in mr-I 8030 (bottom) they are poorly replicated.
Imprints of 100 nm diameter pillars into different thermoplastic resists: Structures in mr-NIL 6000.3 (top) are well replicated, in mr-I 8030 (bottom) only a part of the pillars are present (because they are either ripped away or the stamp were already filled from previous ripping).
Comparison of different thermoplastic materials replicated with Ormostamp molds.
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