Making high-fidelity imprint template by resist patterns over a flexible conductive polymer substrate
Schematic of template-making process by flexible conductive substrate.
Schematic illustrations of the polymer entering into the resist pattern grooves: When the polymer wets the resist, (a) the polymer is cast over the grooves under atmospheric pressure, and (b) the assembly of the polymer and the grooves are evacuated under vacuum pressure of PV; when the polymer does not wet the resist, (c) after evacuating the assembly under vacuum pressure of PV, the assembly is placed into the atmospheric environment again.
(a) SEM images of the patterned resist on polyimide film and (b) the replicated PU template.
SEM images of the PU template: (a) 100 nm pillar array, (b) tilted view of the 100 nm pillar array, (c) 100 nm line array, (d) 60 nm line array, and (e) 25 nm line array.
(Color online) Images of the curved PU template: (a) photograph of the curved PU template and (b) SEM image of the curved PU template.
SEM images of the nickel template.
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