Integration of block copolymer directed assembly with 193 immersion lithography
(Color online) Schematic illustration of the proposed method.
Tilted SEM images of photoresist profile on different thicknesses of silicon nitride films. Note that the bright layer is a combination of X-PS and silicon nitride.
Top-down SEM images of photoresist (a) before and (b) after trim etch and (c) block copolymer after directed assembly.
Top-down SEM image of assembled structures of BCP with a large area of perfection. PMMA has not been removed; thus, the linewidth may be visually inaccurate.
(a) Top-down SEM image after PMMA removal. (b) Tilted cross-sectional image after pattern transfer.
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