(Color online) Schematic illustration of the proposed method.
Tilted SEM images of photoresist profile on different thicknesses of silicon nitride films. Note that the bright layer is a combination of X-PS and silicon nitride.
Top-down SEM images of photoresist (a) before and (b) after trim etch and (c) block copolymer after directed assembly.
Top-down SEM image of assembled structures of BCP with a large area of perfection. PMMA has not been removed; thus, the linewidth may be visually inaccurate.
(a) Top-down SEM image after PMMA removal. (b) Tilted cross-sectional image after pattern transfer.
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