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Seal and encapsulate cavities for complementary metal-oxide-semiconductor microelectromechanical system thermoelectric power generators
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10.1116/1.3556954
/content/avs/journal/jvstb/29/2/10.1116/1.3556954
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/29/2/10.1116/1.3556954

Figures

Image of FIG. 1.
FIG. 1.

(Color online) Schematic view of the proposed TPG with configuration of top and bottom cavities.

Image of FIG. 2.
FIG. 2.

(Color online) Simulated temperature distribution for four designs: (a) with top and bottom vacuum cavities, ; (b) with top and bottom air cavities, ; (c) with only bottom vacuum cavity, ; and (d) with only bottom vacuum cavity, .

Image of FIG. 3.
FIG. 3.

(Color online) Verification process flow for sealing a -deep bottom cavity with PECVD USG.

Image of FIG. 4.
FIG. 4.

SEM images at different steps of the verification process for sealing the bottom vacuum cavity.

Image of FIG. 5.
FIG. 5.

Comparison of cavity sealing methods with PECVD (a) USG and (b) reflowed PSG.

Image of FIG. 6.
FIG. 6.

(Color online) Verification process flow for encapsulating a -high top cavity with PECVD USG.

Image of FIG. 7.
FIG. 7.

SEM images at different steps of the verification process flow for encapsulating top vacuum cavity.

Image of FIG. 8.
FIG. 8.

Shell made with PECVD nitride fails to survive in BOE.

Image of FIG. 9.
FIG. 9.

(Color online) Whole fabrication process flow of the TPG and images at the different steps.

Image of FIG. 10.
FIG. 10.

Cross-section view of the fabricated TPG with -high top cavity and -deep bottom cavity.

Image of FIG. 11.
FIG. 11.

(Color online) Surface profile of the sealed cavity shows that the membrane is strong enough to withstand the vacuum force.

Image of FIG. 12.
FIG. 12.

(Color online) Testing setup for temperature control and voltage measurement and the device with wire bonding for testing.

Image of FIG. 13.
FIG. 13.

(Color online) Output power vs temperature difference under a matched electrical resistance load.

Image of FIG. 14.
FIG. 14.

(Color online) Output power and voltage vs current at a temperature difference of .

Tables

Generic image for table
TABLE I.

Layer information of the fabricated TPG.

Generic image for table
TABLE II.

Characterization of thermoelectric properties for polysilicon at .

Generic image for table
TABLE III.

Comparison with CMOS-compatible TPGs in the literature.

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/content/avs/journal/jvstb/29/2/10.1116/1.3556954
2011-03-16
2014-04-16
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Seal and encapsulate cavities for complementary metal-oxide-semiconductor microelectromechanical system thermoelectric power generators
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/29/2/10.1116/1.3556954
10.1116/1.3556954
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