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Remote H2/N2 plasma processes for simultaneous preparation of low-k interlayer dielectric and interconnect copper surfaces
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10.1116/1.4705732
/content/avs/journal/jvstb/30/3/10.1116/1.4705732
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/30/3/10.1116/1.4705732
/content/avs/journal/jvstb/30/3/10.1116/1.4705732
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/content/avs/journal/jvstb/30/3/10.1116/1.4705732
2012-05-02
2014-08-29
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Remote H2/N2 plasma processes for simultaneous preparation of low-k interlayer dielectric and interconnect copper surfaces
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/30/3/10.1116/1.4705732
10.1116/1.4705732
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