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Boron filling of high aspect ratio holes by chemical vapor deposition for solid-state neutron detector applications
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10.1116/1.4742856
/content/avs/journal/jvstb/30/5/10.1116/1.4742856
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/30/5/10.1116/1.4742856

Figures

Image of FIG. 1.
FIG. 1.

(Color online) Schematic of layer structure and the basic working principle for a honeycomb type solid-state neutron detector (front side p-contact is hidden for clarity).

Image of FIG. 2.
FIG. 2.

Cross-sectional SEM images of (a) 42 μm deep and 3.8 μm wide hexagonal holes and (b) 41 μm deep and 9 μm wide parallel trenches, fabricated using DRIE on silicon substrates. The inset in (a) shows the top view.

Image of FIG. 3.
FIG. 3.

(Color online) (a) Effect of growth temperature on the growth rate and (b) the effect of growth temperature on the conformal coverage ratio with a process pressure of 320 mTorr and a B2H6/H2 flow rate of 80 SCCM in the parallel trench structure.

Image of FIG. 4.
FIG. 4.

(Color online) Effects of process pressure on the growth rate and the conformal coverage ratio with a substrate temperature of 600  °C and a B2H6/H2 flow rate of 50 SCCM in the parallel trench structure.

Image of FIG. 5.
FIG. 5.

Cross-sectional SEM images of the boron film deposited with a B2H6/H2 flow rate of 50 SCCM for (a) 4 h in parallel trenches (T-1), (b) 8 h in hexagonal holes (H-1), and (c) 4 h in hexagonal holes (H-2). The insets show the cross section at the bottom of the microstructure.

Image of FIG. 6.
FIG. 6.

Cross-sectional SEM images of the boron film after (a) the photoresist coating, (b) the flood exposure and development, and (c) the boron etching. The inset in (a) shows the top view.

Image of FIG. 7.
FIG. 7.

Cross-sectional SEM images of the boron film after (a) the boron etching without the photoresist coating, (b) the isotropic ICP-RIE with the photoresist coating, and (c) the anisotropic ICP-RIE with the photoresist coating.

Image of FIG. 8.
FIG. 8.

Cross-sectional SEM images of the boron film after the second boron deposition: (a) top of the hole and (b) bottom of the hole.

Image of FIG. 9.
FIG. 9.

(Color online) Measured pulse height distribution of the 2 by 2 mm2 detector. The counts were recorded for 3000 s and the low level of detection was set at 500 keV while determining the thermal neutron detection efficiency.

Tables

Generic image for table
TABLE I.

Details of the boron deposition conditions, boron thickness on the sidewalls, conformal coverage ratios, and boron fill factors for the samples T-1, H-1, and H-2.

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/content/avs/journal/jvstb/30/5/10.1116/1.4742856
2012-08-09
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Boron filling of high aspect ratio holes by chemical vapor deposition for solid-state neutron detector applications
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/30/5/10.1116/1.4742856
10.1116/1.4742856
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