(Color online) Schematic diagram of the cross-sections of microelectrodes illustrates the time averaged slip velocity and the flow in the bulk liquid of (a) symmetric planar electrodes and (b) 3D stepped electrodes. (c)Schematic diagram of the top view of the interdigitated electrode array. The regions delineated by the black rectangles are raised up.
(Color online) (a)–(e) Schematic diagrams of the fabrication process (not drawn to scale); (f) Exploded view shows major functional layers and structural features; (g) Photograph of a complete device.
(Color online) Microelectrode array is characterized by a profilometer where the electrode height is obtained along aa′.
SEM image shows the structures and metal coverage of the microelectrode array.
(Color online) (a) Setup for shear testing shown in a schematic diagram. (b) Thin layer of PDMS is left after pulling off the PDMS block.
(Color online) After annealing, HSQ develops microcracks without a Ti layer (left), but no microcracks with a 20 nm Ti layer beneath the HSQ layer (right).
(Color online) Generation of microcracks in the bonding layer at (a) no bending, (b) warping against a cylindrical surface of an arc angle of 15° and with a radius of 57 mm, (c) warping against a cylindrical surface of an arc angle of 45° and with a radius of 22 mm, (d) folding at 45°, (e) folding at 90°, and (f) folding at 120° (the dotted lines indicate the original position of substrate without any deformation, while the arrow shows the folding direction).
(Color online) Frequency response at 5Vpp ac voltage.
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