1887
banner image
No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Flexible substrate and release layer for flexible MEMS devices
Rent:
Rent this article for
USD
10.1116/1.4816938
/content/avs/journal/jvstb/31/5/10.1116/1.4816938
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/31/5/10.1116/1.4816938

Figures

Image of FIG. 1.
FIG. 1.

(Color online) (a) Deposition of SiN passivation layer, (b) wrapping wafer with polyimide tape, (c) spin coating PI2611 polyimide, (d) removing polyimide tape and curing the polyimide, (e) deposition of PI5878G substrate polyimide, (f) separating the flexible substrate from the rigid silicon wafer. It needs to mention here that this figure only depicts substrate formation and release. More device dependent fabrication steps are needed to fabricate a device.

Image of FIG. 2.
FIG. 2.

(Color online) (a) Removing the edge of the flexible substrate from silicon wafer using a cutting tool; (b) a piece of flexible substrate after removal from the silicon wafer which is also demonstrating a sample metallization layer fabricated through sputtering and lift-off process.

Tables

Generic image for table
TABLE I.

Glass transition temperature of typical polyimide/flexible substrate materials.

Generic image for table
TABLE II.

Comparison of coefficient of thermal expansion and Young's modulus of the cured polyimides used with the silicon ⟨111⟩ carrier wafer.

Loading

Article metrics loading...

/content/avs/journal/jvstb/31/5/10.1116/1.4816938
2013-08-01
2014-04-18
Loading

Full text loading...

This is a required field
Please enter a valid email address
752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Flexible substrate and release layer for flexible MEMS devices
http://aip.metastore.ingenta.com/content/avs/journal/jvstb/31/5/10.1116/1.4816938
10.1116/1.4816938
SEARCH_EXPAND_ITEM