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Journal of Electronic Packaging
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December 2009
Volume 131, Issue 4, Articles (04xxxx), 70 pages
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Research Papers

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, and Sheng Liu

J. Electron. Packag. 131, 041001 (2009) (6 pages)

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A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

Chuen-Ching Wang, Wen-Ran Yang, Jin-Jia Chen, and Wei-Wen Shi

J. Electron. Packag. 131, 041002 (2009) (8 pages)

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The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Dominiek Degryse, Bart Vandevelde, Eric Beyne, and Joris Degrieck

J. Electron. Packag. 131, 041003 (2009) (6 pages)

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The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Jose Omar S. Amistoso and Alberto V. Amorsolo, Jr.

J. Electron. Packag. 131, 041004 (2009) (6 pages)

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Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, and Y. C. Lee

J. Electron. Packag. 131, 041005 (2009) (9 pages)

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Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Jun Zeng, Renli Fu, Simeon Agathopoulos, Shaodong Zhang, Xiufeng Song, and Hong He

J. Electron. Packag. 131, 041006 (2009) (7 pages)

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Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, and Jae Pil Jung

J. Electron. Packag. 131, 041007 (2009) (5 pages)

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Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film

Jianhua Zhang, Fang Yuan, and Jinsong Zhang

J. Electron. Packag. 131, 041008 (2009) (5 pages)

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Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, and Jing-Fung Lin

J. Electron. Packag. 131, 041009 (2009) (7 pages)

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A Novel Ceramic Packaging Technique Using Selective Induction Heating

Sheng Liu, Wenming Liu, Changyong Lin, and Mingxiang Chen

J. Electron. Packag. 131, 041010 (2009) (5 pages)

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Technical Briefs

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Pei-Hsuan Lee, Hsien-Cheng Tseng, and Jung-Hua Chou

J. Electron. Packag. 131, 044501 (2009) (3 pages)

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Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, and D. Edwards

J. Electron. Packag. 131, 044502 (2009) (3 pages)

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