Electron microdiffraction of faulted regions in Co-Cr and Co-Ni-Cr thin films
Appl. Phys. Lett. 55, 229 (1989); doi:10.1063/1.101915
Issue Date: 17 July 1989
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The planar defects which are commonly observed in deposited Co-Cr and Co-Ni-Cr magnetic thin films have been characterized by electron microdiffraction and trace analysis. It was unambiguously shown that these planar defects are (0001) stacking faults, which are thought to be formed to reduce the growth stress of the film during deposition.
Applied Physics Letters is copyrighted by The American Institute of Physics.
| History: | Received 20 February 1989; accepted 11 May 1989 |
| Permalink: |
http://link.aip.org/link/?APPLAB/55/229/1 |
KEYWORDS and PACS
THIN FILMS,
STACKING FAULTS,
ELECTRON DIFFRACTION,
COBALT BASE ALLOYS,
NICKEL ALLOYS,
CHROMIUM ALLOYS,
MICROSTRUCTURE,
FILM GROWTH,
STRESSES,
CRYSTAL DEFECTS,
GRAIN SIZE,
TWINNING,
SPUTTERING,
VAPOR DEPOSITED COATINGS,
CHROMIUM,
GLASS
- 68.55.Ln
Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) Thin films: growth, structure, epitaxy, and nonelectronic properties Defects and impurities: doping, implantation, distribution, concentration, etc. - 81.15.Cd
Materials science Methods of deposition of films and coatings Deposition by sputtering - 68.55.Jk
Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) Thin films: growth, structure, epitaxy, and nonelectronic properties Structure and morphology; thickness - YEAR: 1988-89
RELATED DATABASES
PUBLICATION DATA
0003-6951 (print)
1077-3118 (online)
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