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Ballistic phonon transmission across wafer-bonded crystals

Appl. Phys. Lett. 74, 821 (1999); doi:10.1063/1.123379

Issue Date: 8 February 1999

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M. E. Msall
Max Planck Institut für Festkörperforschung, Postfach 800665, D-70506 Stuttgart, Germany

A. Klimashov
Paul Drude Institut für Festkörperelektronik, Hausvogteiplatz, 5-7, D-10117 Berlin, Germany

S. Kronmüller
Max Planck Institut für Festkörperforschung, Postfach 800665, D-70506 Stuttgart, Germany

H. Kostial
Paul Drude Institut für Festkörperelektronik, Hausvogteiplatz, 5-7, D-10117 Berlin, Germany

W. Dietsche
Max Planck Institut für Festkörperforschung, Postfach 800665, D-70506 Stuttgart, Germany

K. Friedland
Paul Drude Institut für Festkörperelektronik, Hausvogteiplatz 5-7, Berlin, Germany
We have studied phonon transmission through wafer-bonded GaAs–GaAs interfaces using the techniques of phonon imaging. The short wavelength phonons used for imaging (lambda [approximate] 10 nm) are an extremely sensitive probe of the bond. We report unprecedented transmission of phonons through carefully prepared bonds. This transmission is remarkable since strong phonon scattering is usually observed at virtually any free surface. The dramatic differences between phonon transmission through well bonded interfaces and phonon transmission through poorly bonded interfaces are the basis of an easily determined quality factor of the bond. In contrast to electron microscopy, the phonon measurements of bond quality are not destructive. ©1999 American Institute of Physics.
History: Received 6 July 1998; accepted 23 November 1998
Permalink: http://link.aip.org/link/?APPLAB/74/821/1
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KEYWORDS and PACS

Keywords
PACS
  • 68.35.Ja
    Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) Solid surfaces and solid–solid interfaces Surface and interface dynamics and vibrations
  • 81.05.Ea
    Materials science Specific materials: fabrication, treatment, testing and analysis III–V semiconductors
  • YEAR: 1999

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PUBLICATION DATA

ISSN:
0003-6951 (print)   1077-3118 (online)
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REFERENCES (13)
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