The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper
Appl. Phys. Lett. 85, 5197 (2004); doi:10.1063/1.1828213
Issue Date: 29 November 2004
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Microhardness measurements have been carried out on high purity Cu samples with average grain sizes ranging from ~10 to ~200 nm, over temperatures from liquid nitrogen to ambient, and dwell-times of the indenter in the sample from 5 s to 39 h. The Vickers hardness diminishes approximately linearly with the logarithm of the dwell-time. At short dwell-times the hardness increases significantly with decreasing grain size and with decreasing temperature, but the influence of these variables substantially diminishes at longer times. Investigation by transmission electron microscopy shows that rapid grain growth under the indenter most likely is responsible for the strong and long-lasting indentation creep.
©2004 American Institute of Physics
| History: | Received 26 August 2004; accepted 11 October 2004 |
| Permalink: |
http://link.aip.org/link/?APPLAB/85/5197/1 |
KEYWORDS and PACS
copper,
nanostructured materials,
grain size,
grain growth,
microhardness,
Vickers hardness,
indentation,
creep,
transmission electron microscopy
- 81.07.Bc
Nanocrystalline materials: fabrication and characterization - 62.25.+g
Mechanical properties of nanoscale materials - 81.40.Np
Fatigue, embrittlement, fracture, and failure including corrosion fatigue and cracking - 81.40.Lm
Deformation, plasticity, and creep - 61.46.+w
Structure of nanoscale materials: clusters, nanoparticles, nanotubes, and nanocrystals - 62.20.Qp
Tribology and hardness - 62.20.Mk
Fatigue, brittleness, fracture, and cracks - 62.20.Hg
Creep - YEAR: 2004
RELATED DATABASES
PUBLICATION DATA
0003-6951 (print)
1077-3118 (online)
REFERENCES (10)
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- R. Schwaiger, B. Moser, M. Dao, N. Chollacoop, and S. Suresh,
Acta Mater. 51, 5159 (2003) . - Y. M. Wang and E. Ma, Appl. Phys. Lett. 83, 3165 (2003).
- N. Wang, Z. Wang, K. T. Aust, and U. Erb,
Mater. Sci. Eng., A 237, 150 (1997) . - Z. Huang, L. Y. Gu, and J. R. Weertman,
Scr. Mater. 37, 1071 (1997) . - P. G. Sanders, J. A. Eastman, and J. R. Weertman,
Acta Mater. 45, 4019 (1997) . Vacuum conditions and helium purity have recently been improved further by an order of magnitude or greater. - B.E. Warren, X-Ray Diffraction (Dover, New York, 1990).
- J. R. Weertman, D. Farkas, K. Hemker, H. Kung, M. Mayo, and H. Van Swygenhoven,
MRS Bull. 24, 44 (1999) . - H. Van Swygenhoven, M. Spaczer, and A. Caro,
Acta Mater. 47, 3117 (1999) . - J. Weertman and J.R. Weertman, in Physical Metallurgy, 3rd ed., edited by R. W. Cahn and P. Haasen (North-Holland, Amsterdam, 1983), p. 1315.
- J. Schiøtz,
Mater. Sci. Eng., A 375-377, 975 (2004) .







