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The influence of time, temperature, and grain size on indentation creep in high-purity nanocrystalline and ultrafine grain copper

Appl. Phys. Lett. 85, 5197 (2004); doi:10.1063/1.1828213

Issue Date: 29 November 2004

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Kai Zhang and J. R. Weertman
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208

J. A. Eastman
Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60439
Microhardness measurements have been carried out on high purity Cu samples with average grain sizes ranging from ~10 to ~200  nm, over temperatures from liquid nitrogen to ambient, and dwell-times of the indenter in the sample from 5 s to 39 h. The Vickers hardness diminishes approximately linearly with the logarithm of the dwell-time. At short dwell-times the hardness increases significantly with decreasing grain size and with decreasing temperature, but the influence of these variables substantially diminishes at longer times. Investigation by transmission electron microscopy shows that rapid grain growth under the indenter most likely is responsible for the strong and long-lasting indentation creep. ©2004 American Institute of Physics
History: Received 26 August 2004; accepted 11 October 2004
Permalink: http://link.aip.org/link/?APPLAB/85/5197/1
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KEYWORDS and PACS

Keywords
PACS
  • 81.07.Bc
    Nanocrystalline materials: fabrication and characterization
  • 62.25.+g
    Mechanical properties of nanoscale materials
  • 81.40.Np
    Fatigue, embrittlement, fracture, and failure including corrosion fatigue and cracking
  • 81.40.Lm
    Deformation, plasticity, and creep
  • 61.46.+w
    Structure of nanoscale materials: clusters, nanoparticles, nanotubes, and nanocrystals
  • 62.20.Qp
    Tribology and hardness
  • 62.20.Mk
    Fatigue, brittleness, fracture, and cracks
  • 62.20.Hg
    Creep
  • YEAR: 2004

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PUBLICATION DATA

ISSN:
0003-6951 (print)   1077-3118 (online)
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REFERENCES (10)

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