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Solid-state supercapacitors for electronic device applications

Appl. Phys. Lett. 87, 123503 (2005); doi:10.1063/1.2051797

Published 13 September 2005

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Liping Ma and Yang Yang
Department of Materials Science and Engineering, University of California Los Angeles, Los Angeles, California 90095
We report an all-solid-state supercapacitor with device fabrication by a simple vacuum thermal evaporation method, which allows not only a multilayer stacking structure to further enhance the capacitance, but also permits the supercapacitor to be easily incorporated with other electronic devices, showing interesting characteristics for both fundamental study and practical applications. Discussions about the mechanism of the supercapacitor is given. ©2005 American Institute of Physics
History: Received 26 May 2005; accepted 27 July 2005; published 13 September 2005
Permalink: http://link.aip.org/link/?APPLAB/87/123503/1
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0003-6951 (print)   1077-3118 (online)
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REFERENCES (16)
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