Modified effective medium formulation for the thermal conductivity of nanocomposites
Appl. Phys. Lett. 91, 073105 (2007); doi:10.1063/1.2771040
Published 14 August 2007
You are not logged in to this journal. Log in
This letter introduces a modified effective medium formulation for composites where the characteristic length of the inclusion is on the order of or smaller than the phonon mean free path. The formulation takes into account the increased interface scattering in the different phases of the nanocomposite and the thermal boundary resistance between the phases. The interface density of inclusions is introduced and is found to be a primary factor in determining the thermal conductivity. The predictions are in good agreement with results from Monte Carlo simulations and solutions to the Boltzmann equation.
©2007 American Institute of Physics
| History: | Received 5 July 2007; accepted 20 July 2007; published 14 August 2007 |
| Permalink: |
http://link.aip.org/link/?APPLAB/91/073105/1 |
KEYWORDS and PACS
- 72.15.Eb
Electrical and thermal conduction in crystalline metals and alloys - 61.72.Qq
Microscopic defects (voids, inclusions, etc.) - 63.22.+m
Phonons or vibrational states in low-dimensional structures and nanoscale materials - 63.20.Dj
Phonon states and bands, normal modes, and phonon dispersion - YEAR: 2007
RELATED DATABASES
PUBLICATION DATA
0003-6951 (print)
1077-3118 (online)
REFERENCES (12)
For access to fully linked references, you need to log in.
For access to fully linked references, you need to Log in.
- M. J. Biercuk, M. C. Llaguno, M. Radosavljevic, J. K. Hyun, A. T. Johnson, and J. E. Fischer, Appl. Phys. Lett. 80, 15, (2002).
- R. Yang, G. Chen, and M. Dresselhaus, Phys. Rev. B 72, 125418 (2005).
- R. Yang, G. Chen, and M. Dresselhaus,
Nano Lett. 5, 1111 (2005) . - R. Prasher, J. Appl. Phys. 100, 034307 (2006).
- R. Prasher, J. Appl. Phys. 100, 064302 (2006).
- L. Rayleigh, Philos. Mag. 34, 481 (1892).
- J. C. Maxwell, A Treatise on Electricity and Magnetism (Clarendon, Oxford, 1904), Vol. 1.
- D. P. H. Hasselman and L. F. Johnson,
J. Compos. Mater. 21, 508 (1987) . - Y. Benveniste, J. Appl. Phys. 61, 2840 (1987).
- C.-W. Nan, R. Birringer, D. R. Clarke, and H. Gleiter, J. Appl. Phys. 81, 6692 (1997).
- M.-S. Jeng, R. Yang, D. Song, and G. Chen, Proceedings of the Conference on Integration and Packaging of MEMS, NEMS, and Electronic Systems, San Francisco, CA, 2005 (unpublished),
- G. Chen, Phys. Rev. B 57, 14958 (1998).







