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Thermal conductance of bimaterial microcantilevers

Appl. Phys. Lett. 92, 063509 (2008); doi:10.1063/1.2829999

Published 13 February 2008

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Sheng Shen
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

Arvind Narayanaswamy
Department of Mechanical Engineering, Columbia University, New York, New York 10027, USA

Shireen Goh
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

Gang Chen
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
In this letter, based on the beam theory and the thermal analysis of a bimaterial cantilever, we demonstrate that the effective thermal conductance of the cantilever and the temperature at the tip of the cantilever can be determined by measuring the bending of the cantilever in response to two different thermal inputs: power absorbed at the tip and ambient temperature. ©2008 American Institute of Physics
History: Received 5 October 2007; accepted 9 December 2007; published 13 February 2008
Permalink: http://link.aip.org/link/?APPLAB/92/063509/1
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KEYWORDS and PACS

Keywords
PACS
  • 07.10.Cm
    Micromechanical devices and systems
  • YEAR: 2008

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ISSN:
0003-6951 (print)   1077-3118 (online)
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