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Organometallic vapor phase epitaxial growth of GaN on ZrN/AlN/Si substrates

Appl. Phys. Lett. 93, 023109 (2008); doi:10.1063/1.2953541

Published 16 July 2008

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Mark H. Oliver,1,3 Jeremy L. Schroeder,1,3 David A. Ewoldt,1,3 Isaac H. Wildeson,1,2 Vijay Rawat,1,3 Robert Colby,1,3 Patrick R. Cantwell,1,3 Eric A. Stach,1,3 and Timothy D. Sands1,2,3
1School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, USA
2School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, USA
3Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA

An intermediate ZrN/AlN layer stack that enables the epitaxial growth of GaN on (111) silicon substrates using conventional organometallic vapor phase epitaxy at substrate temperatures of ~1000  °C is reported. The epitaxial (111) ZrN layer provides an integral back reflector and Ohmic contact to n-type GaN, whereas the (0001) AlN layer serves as a reaction barrier, as a thermally conductive interface layer, and as an electrical isolation layer. Smooth (0001) GaN films less than 1  µm thick grown on ZrN/AlN/Si yield 0002 x-ray rocking curve full width at half maximum values as low as 1230  arc  sec. ©2008 American Institute of Physics
History: Received 22 April 2008; accepted 12 June 2008; published 16 July 2008
Permalink: http://link.aip.org/link/?APPLAB/93/023109/1
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KEYWORDS and PACS

Keywords
PACS
  • 81.15.Gh
    Chemical vapor deposition
  • 81.15.Kk
    Vapor phase epitaxy; growth from vapor phase
  • 68.55.ag
    Semiconductor thin film nucleation and growth
  • YEAR: 2008

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PUBLICATION DATA

ISSN:
0003-6951 (print)   1077-3118 (online)
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