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Local, submicron, strain gradients as the cause of Sn whisker growth

Appl. Phys. Lett. 94, 221901 (2009); doi:10.1063/1.3147864

Published 2 June 2009

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M. Sobiech,1,2 M. Wohlschlögel,1 U. Welzel,1 E. J. Mittemeijer,1 W. Hügel,2 A. Seekamp,2 W. Liu,3 and G. E. Ice4
1Max Planck Institute for Metals Research, Heisenbergstrasse 3, D-70569 Stuttgart, Germany
2Robert Bosch GmbH, Dieselstrasse 6, D-72770 Reutlingen, Germany
3Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439, USA
4Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831-6118, USA
It has been shown experimentally that local in-plane residual strain gradients occur around the root of spontaneously growing Sn whiskers on the surface of Sn coatings deposited on Cu. The strain distribution has been determined with synchrotron white beam micro Laue diffraction measurements. The observed in-plane residual strain gradients in combination with recently revealed out-of-plane residual strain-depth gradients [M. Sobiech et al., Appl. Phys. Lett. 93, 011906 (2008)] provide the driving forces for whisker growth. ©2009 American Institute of Physics
History: Received 21 April 2009; accepted 11 May 2009; published 2 June 2009
Permalink: http://link.aip.org/link/?APPLAB/94/221901/1
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KEYWORDS and PACS

Keywords
PACS
  • 68.70.+w
    Whiskers and dendrites
  • 81.65.-b
    Surface treatments
  • 68.60.Bs
    Mechanical and acoustical properties of thin films
  • YEAR: 2009

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ISSN:
0003-6951 (print)   1077-3118 (online)
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