Enhancement of electric force by ion-neutral collisions
The measured force exerted on an ion flow by an electric field is found to be larger than the electric force that can be exerted if the ions are collisionless. In addition, the increase of the gas pre...
The measured force exerted on an ion flow by an electric field is found to be larger than the electric force that can be exerted if the ions are collisionless. In addition, the increase of the gas pre...
Purified Si film formation from metallurgical-grade Si by hydrogen plasma induced chemical transport
Purified Si film is prepared directly from metallurgical-grade Si (MG-Si) by using hydrogen plasma induced chemical transport at subatmospheric pressure. The purification mechanism is based on the dif...
Purified Si film is prepared directly from metallurgical-grade Si (MG-Si) by using hydrogen plasma induced chemical transport at subatmospheric pressure. The purification mechanism is based on the dif...
Terahertz vacuum electronic circuits fabricated by UV lithographic molding and deep reactive ion etching
Appl. Phys. Lett. 95, 181505 (2009); doi:10.1063/1.3259823
Published 6 November 2009
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The 0.22 THz vacuum electronic circuits fabricated by UV lithography molding and deep reactive ion etching processes are under investigation for submillimeter wave applications. Eigenmode transient simulations show that, accounting for realistic values of our currently achievable fabrication tolerances, the transmission, and dispersion properties of the operation modes of a TE-mode, staggered, double grating circuit are maintained within less than 1 dB and 2% deviation, respectively. Scanning electron microscopy and atomic force microscopy analyses of the fabricated circuit samples demonstrate that both of the microelectromechanical system fabrication approaches produce circuits with ±3–5 µm dimensional tolerance and ~30 nm surface roughness.
©2009 American Institute of Physics
| History: | Received 8 September 2009; accepted 16 October 2009; published 6 November 2009 |
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http://link.aip.org/link/?APPLAB/95/181505/1 |
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0003-6951 (print)
1077-3118 (online)
AIP
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