Properties of La-silicate high-K dielectric films formed by oxidation of La on silicon
J. Appl. Phys. 93, 1691 (2003); doi:10.1063/1.1531818
Issue Date: 1 February 2003
You are not logged in to this journal. Log in
In this article, we present data on the properties of La-based high-k dielectric films prepared by oxidation of La deposited by physical vapor deposition on silicon. Films are characterized by x-ray photoelectron spectroscopy, infrared absorption, and capacitance versus voltage analysis. We find that when we oxidize La metal sputter deposited on Si substrates, it reacts with the silicon substrate to form La silicate. La films as thick as 300 Å will react completely with Si under moderate oxidation conditions (900 °C for 10 min) suggesting a very rapid silicidation reaction between La and Si. Under some processing conditions the as-deposited films contain a small La2O3 component that reduces to La silicate upon anneal at high temperatures. La-silicate films do not phase separate into La2O3 and SiO2 upon annealing at 1050 °C, and their resistance to H2O incorporation depends critically on the oxidation temperature. Electrical measurements show a high concentration of positive fixed charge. ©2003 American Institute of Physics.
| History: | Received 31 July 2002; accepted 31 October 2001 |
| Permalink: |
http://link.aip.org/link/?JAPIAU/93/1691/1 |
KEYWORDS and PACS
lanthanum compounds,
dielectric thin films,
oxidation,
X-ray photoelectron spectra,
MIS capacitors,
capacitance,
chemical interdiffusion,
rapid thermal annealing,
thermal stability,
spectrochemical analysis
- 77.84.Bw
Dielectric, piezoelectric, and ferroelectric elements, oxides, nitrides, borides, carbides, chalcogenides, etc. - 77.55.+f
Dielectric thin films - 81.65.Mq
Surface oxidation - 73.40.Qv
Electrical properties of metalinsulatorsemiconductor structures including semiconductor-to-insulator - 79.60.Jv
Photoelectron spectra of interfaces; heterostructures; nanostructures - 68.35.Fx
Diffusion; interface formation (solid surfaces) - 68.60.Dv
Thermal stability of thin films; thermal effects - 82.80.Gk
Chemical analytical methods involving vibrational spectroscopy - YEAR: 2003
RELATED DATABASES
PUBLICATION DATA
0021-8979 (print)
1089-7550 (online)
REFERENCES (30)
For access to fully linked references, you need to log in.
For access to fully linked references, you need to Log in.
- S. I. Association, The International Technology Roadmap for Semiconductors (International SEMATECH Austin, TX, 1999).
- G. D. Wilk, R. M. Wallace, and J. M. Anthony, J. Appl. Phys. 89, 5243 (2001) and references therein.
- J.-P. Maria, D. Wicaksana, A. I. Kingon, B. Busch, H. Schulte, E. Garfunkel, and T. Gustafsson, J. Appl. Phys. 90, 918 (2001).
- K. B. Hubbard and D. G. Schlom,
J. Mater. Res. 11, 2757 (1996) . - J. J. Chambers and G. N. Parsons, J. Appl. Phys. 90, 918 (2001).
- D. Niu, R. W. Ashcraft, Z. Chen, S. Stemmer, and G. N. Parsons, Appl. Phys. Lett. 81(4), 676 (2002).
- H. Yamada, T. Shimizu, and E. Suzuki,
Jpn. J. Appl. Phys., Part 2 41, L368 (2002) . - M. Copel, E. Cartier, and F. M. Ross, Appl. Phys. Lett. 78, 1607 (2001).
- J. J. Chambers, B. W. Busch, W. H. Schulte, T. Gustafsson, E. Garfunkel, S. Wang, D. M. Maher, T. M. Klein, and G. N. Parsons,
Appl. Surf. Sci. 181, 78 (2001) . - http://rsb.info.nih.gov/ij/
- N. Yang, K. W. Henson, J. R. Hauser, and J. J. Wortman,
IEEE Trans. Electron Devices 46, 1464 (1999) . - J. F. Moulder, W. F. Stickle, P. E. Sobol, and K. D. Bomben, Handbook of X-ray Photoelectron Spectroscopy (Perkin-Elmer Corporation, Eden Prairie, MN, 1992)
- Y. Uwamino, T. Ishizuka, and H. Yamatera,
J. Electron Spectrosc. Relat. Phenom. 34, 67 (1984) . - C. C. Hsu, J. Ho, J. J. Qian, Y. T. Wang, and Y. X. Wang,
Vacuum 41, 1425 (1990) . - R. D. Thompson, B. Y. Tsaur, and K. N. Tu, Appl. Phys. Lett. 38, 535 (1991).
- H. Ono and T. Katsumata, Appl. Phys. Lett. 78, 1832 (2001).
- J. J. Chambers and G. N. Parsons, Appl. Phys. Lett. 77, 2385 (2000).
- J. C. Fitzmaurice, A. Hector, T. Rowley, and I. P. Parkin,
Polyhedron 13, 235 (1994) . - S. Stemmer, J.-P. Maria, and A. I. Kingon, Appl. Phys. Lett. 79, 102 (2001).
- C. T. Kirk, Phys. Rev. B 38, 1255 (1988).
- F. Petru and A. Muck,
Z. Chem. 6, 386 (1966) . - M. P. Rosynek and D. T. Magnuson,
J. Catal. 46, 402 (1977) . - S. Bernal, J. A. Diaz, R. Garcia, and J. M. Rodriguez-Izquierdo,
J. Mater. Sci. 20, 537 (1985) . - P. Caro and M. Lamaitre Blaise, C. R. Seances Acad. Sci., Ser. C 269, 687 (1969);
- M. Nieminen, M. Putkonen, and L. Niinistö,
Appl. Surf. Sci. 174, 155 (2001) . - B. Klingenberg and M. A. Vannice,
Chem. Mater. 8, 2755 (1996) . - S. Guha, E. Cartier, M. A. Gribelyuk, N. A. Bojarczuk, and M. C. Copel, Appl. Phys. Lett. 77, 2710 (2000).
- S. M. Sze, Physics of Semiconductor Devices (Wiley, New York, 1981).
- J. C. Wang, S. H. Chiao, C. L. Lee, T. F. Lei, Y. M. Lin, M. F. Wang, S. C. Chen, C. H. Yu, and M. S. Liang, J. Appl. Phys. 92, 3936 (2002).
- M. Houssa, V. V. Afanas'ev, A. Stesmans, and M. M. Heyns, Appl. Phys. Lett. 79, 3134 (2001).
P. E. Caro, J. O. Sawyer, and L. Eyring,







