Focusing of surface-acoustic-wave fields on (100) GaAs surfaces
J. Appl. Phys. 94, 7848 (2003); doi:10.1063/1.1625419
Issue Date: 15 December 2003
You are not logged in to this journal. Log in
Focused surface-acoustic waves (SAWs) provide a way to reach intense acoustic fields for electro- and optoacoustic applications on semiconductors. We have investigated the focusing of SAWs by interdigital transducers (IDTs) deposited on (100)-oriented GaAs substrates. The focusing IDTs have curved fingers designed to account for the acoustic anisotropy of the substrate. Different factors that affect focusing, such as the aperture angle and the configuration of the IDT fingers, were systematically addressed. We show that the focusing performance can be considerably improved by appropriate choice of the IDT metal pads, which, under appropriate conditions, create an acoustic waveguide within the IDT. We demonstrate the generation of narrow (full width at half maximum of approx 15 µm), high-frequency (0.5 GHz), continuous SAW beams with vertical displacement as high as 4 nm collimated over distances that exceed 100 µm. ©2003 American Institute of Physics.
| History: | Received 3 June 2003; accepted 19 September 2003 |
| Permalink: |
http://link.aip.org/link/?JAPIAU/94/7848/1 |
REFERENCES (32)
For access to fully linked references, you need to log in.
For access to fully linked references, you need to Log in.
- R. M. White, Proc. IEEE 58, 1238 (1970).
- A. A. Oliner, Acoustic Surface Waves (Springer, Berlin, 1994).
- D. Royer and E. Dieulesaint, Elastic Waves in Solids (Springer, Heidelberg, 2000).
- F. C. Jain and K. K. Bhattacharjee, Proc. SPIE 1347, 614 (1990).
- M. J. Hoskins, H. Morkoç, and B. J. Hunsinger, Appl. Phys. Lett. 41, 332 (1982).
- P. V. Santos, J. Appl. Phys. 89, 5060 (2001).
- F. W. Beil, A. Wixforth, and R. H. Blick, Physica E 13, 473 (2002).
- Y. Takagaki, E. Wiebicke, P. V. Santos, R. Hey, and K. H. Ploog, Semicond. Sci. Technol. 17, 1008 (2002).
- C. Rocke, S. Zimmermann, A. Wixforth, J. P. Kotthaus, G. Böhm, and G. Weimann, Phys. Rev. Lett. 78, 4099 (1997).
- P. V. Santos, M. Ramsteiner, and F. Jungnickel, Appl. Phys. Lett. 72, 2099 (1998).
- T. Sogawa, P. V. Santos, S. K. Zhang, S. Eshlaghi, A. D. Wieck, and K. H. Ploog, Phys. Rev. B 63, 121307(R) (2001).
- F. Alsina, P. V. Santos, H.-P. Schönherr, W. Seidel, K. H. Ploog, and R. Nötzel, Phys. Rev. B 66, 165330 (2002).
- C. Bödefeld, A. Wixforth, J. Toivonen, M. Sopanen, and H. Lipsanen, Phys. Status Solidi B 224, 703 (2001).
- F. Alsina, P. V. Santos, R. Hey, A. García-Cristóbal, and A. Cantarero, Phys. Rev. B 64, 041304 (2001).
- T. Sogawa, P. V. Santos, S. K. Zhang, S. Eshlaghi, A. D. Wieck, and K. H. Ploog, Phys. Rev. Lett. 87, 276601 (2001).
- M. G. Cohen, J. Appl. Phys. 38, 3821 (1967).
- I. M. Mason and E. A. Ash, J. Appl. Phys. 42, 5343 (1971).
- J. B. Green, G. S. Kino, and B. T. Khuri-Yakub, in Proceedings of the 1980 IEEE Ultrasonic Symposium, edited by B. R. McAvoy (IEEE, New York, 1980), pp. 6573.
- Y. N. Borodii, I. M. Grankin, and Y. V. Nepochatykh, Sov. Phys. Acoust. 31, 264 (1985).
- J. Z. Wilcox and R. E. Brooks, J. Appl. Phys. 58, 1148 (1985).
- J. Z. Wilcox and R. E. Brooks, J. Appl. Phys. 58, 1160 (1985).
- S. R. Fang, S. Y. Zhang, and Z. F. Lu, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 36, 178 (1989).
- H. E. Engan, T. Myrtveit, and J. O. Askautrud, Opt. Lett. 24, 24 (1991).
- W. Sauer et al., Appl. Phys. Lett. 75, 1709 (1999).
- M. Streibl, H.-J. Kutschera, W. Sauer, and A. Wixforth, in Proceedings of the 2000 IEEE Ultrasonics Symposium, edited by S. C. Schneider, M. Levy, and B. R. McAvoy (IEEE, New York, 2000), pp. 205208.
- C. Bödefeld, F. Beil, H.-J. Kutschera, M. Streibl, and A. Wixforth, 2001 Ultrasonic Symposium, 2001, p. 69.
- T. Hesjedal and G. Behme, Appl. Phys. Lett. 79, 1054 (2001).
- A. J. De Vries, R. L. Miller, and T. J. Wojcik, in Proceedings of the 1972 IEEE Ultrasonic Symposium, edited by J. De Klerf (IEEE, New York, 1972), pp. 353358.
- W. D. Hung, R. L. Miller, and B. J. Hunsinger, J. Appl. Phys. 60, 3532 (1986).
- C. M. Flannery, E. Chilla, S. Semenov, and H.-J. Fröhlich, in Proceedings of the 1999 IEEE Ultrasonic Symposium, edited by S. C. Schneider, M. Levy, and B. K. McAvoy (IEEE, New York, 1999), pp. 501504.
- W. D. Hung, Y. Kim, and F. M. Fliegel, J. Appl. Phys. 69, 1936 (1991).
- H. Seidel and D. L. White, U.S. Patent No. 3,406,358 (filed 1968).







