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A two-dimensional model of the deformation of photoresist structures using elastoplastic polymer properties

J. Appl. Phys. 96, 1857 (2004); doi:10.1063/1.1768614

Issue Date: 15 August 2004

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K. Yoshimoto, M. P. Stoykovich, H. B. Cao, J. J. de Pablo, and P. F. Nealey
Department of Chemical Engineering and Center for Nanotechnology, University of Wisconsin, 1415 Engineering Drive, Madison, Wisconsin 53706

W. J. Drugan
Department of Engineering Physics, University of Wisconsin, 1500 Engineering Drive, Madison, Wisconsin 53706
A model was developed for predicting the collapse behavior of photoresist structures due to the drying of rinse liquids during wet chemical processing. The magnitude of the capillary forces was estimated using the classical thermodynamics of surface tension, and the deformation of the structure was modeled using beam bending mechanics that accounts for both elastic and plastic modes of deformation. The two-dimensional model can predict the critical beam height of collapse as a function of the wetting behavior of the rinse liquid on the beam, the elastic and plastic mechanical properties of the polymeric photoresist, and the beam dimensions. Collapse behavior was predicted for polymer nanostructures with elastoplastic mechanical properties similar to those of bulk poly(methyl methacrylate). We have compared the collapse predictions from our model with the results of models that account only for elastic or plastic deformation behavior. Regimes in the elastic-plastic mechanical property space for which it is necessary to use the developed beam bending model have been highlighted. It is shown that in some cases the inclusion of both elastic and plastic mechanical properties is necessary for modeling the collapse behavior of polymer beams fabricated using the lithographic process. ©2004 American Institute of Physics
History: Received 2 February 2004; accepted 12 May 2004
Permalink: http://link.aip.org/link/?JAPIAU/96/1857/1
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KEYWORDS and PACS

Keywords
PACS
  • 81.40.Lm
    Deformation, plasticity, and creep
  • 61.41.+e
    Structure of polymers, elastomers, and plastics
  • 85.40.Hp
    Lithography, masks and pattern transfer (microelectronics)
  • 62.20.Fe
    Deformation and plasticity including yield, ductility, and superplasticity
  • 68.03.Cd
    Surface tension and related phenomena
  • 81.40.Jj
    Elasticity and anelasticity, stress-strain relations
  • 62.20.Dc
    Elasticity, elastic constants
  • YEAR: 2004

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PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
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REFERENCES (19)
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