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Dielectric scaling of a zero-Schottky-barrier, 5  nm gate, carbon nanotube transistor with source/drain underlaps

J. Appl. Phys. 100, 024317 (2006); doi:10.1063/1.2218764

Published 28 July 2006

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Khairul Alam and Roger K. Lake
Department of Electrical Engineering, University of California, Riverside, California 92521-0204
The effect of gate dielectric on coaxially gated, Schottky-barrier, carbon nanotube field-effect transistors with source and drain underlaps is investigated. For 2  nm thick dielectrics, the substitution of SiO2 with ZrO2 has little effect on the on-current and the subthreshold slope. The principal effect is a change in the intrinsic and parasitic gate capacitances which affects the delay time, cut-off frequency, and Coulomb blockade of the ambipolar leakage current. Using a relatively low-K gate dielectric (as opposed to a high-K gate dielectric) increases the speed performance by reducing parasitic components of the gate capacitance. For a 50  nm long, 1.5  nm diameter, zero-Schottky-barrier carbon nanotube (CNT) with a 5  nm gate and a 2  nm SiO2 dielectric, we obtain a delay time of 31  fs, a cutoff frequency of 8.9  THz, an inverse subthreshold slope S=66  mV/dec, and an on-off current ratio of 8×105 with VDD=0.4  V. Oxide thickness dependence of the on-off current ratio, inverse subthreshold slope, and intrinsic cut-off frequency is also investigated. ©2006 American Institute of Physics
History: Received 13 October 2005; accepted 6 May 2006; published 28 July 2006
Permalink: http://link.aip.org/link/?JAPIAU/100/024317/1
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KEYWORDS and PACS

Keywords
PACS
  • 85.30.Tv
    Semiconductor field effect devices
  • 85.35.Kt
    Nanotube devices
  • 73.30.+y
    Surface double layers, Schottky barriers, and work functions
  • 77.84.Bw
    Dielectric, piezoelectric, and ferroelectric elements, oxides, nitrides, borides, carbides, chalcogenides, etc.
  • 77.55.+f
    Dielectric thin films
  • 73.23.Hk
    Coulomb blockade; single-electron tunneling
  • YEAR: 2006

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ISSN:
0021-8979 (print)   1089-7550 (online)
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REFERENCES (47)

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  1. J. Guo et al., Tech. Dig. - Int. Electron Devices Meet. 2, 711 (2002).
  2. A. Javey, M. Shim, and H. Dai, Appl. Phys. Lett. 80, 1064 (2002).
  3. J. Guo, S. Datta, and M. Lundstrom, IEEE Trans. Electron Devices 51, 172 (2004).
  4. J. Guo, J. Wang, E. Polizzi, S. Datta, and M. Lundstrom, IEEE Trans. Nanotechnol. 2, 329 (2003).
  5. J. Guo, M. Lundstrom, and S. Datta, Appl. Phys. Lett. 80, 3192 (2002).
  6. J. Guo, S. Goasguen, M. Lundstrom, and S. Datta, Appl. Phys. Lett. 81, 1486 (2002).
  7. D. V. Singh, K. A. Jenkins, J. Appenzeller, D. Neumayer, A. Grill, and H. S. P. Wong, IEEE Trans. Nanotechnol. 3, 383 (2004).
  8. J. Appenzeller and D. J. Frank, Appl. Phys. Lett. 84, 1771 (2004).
  9. S. Heinze, J. Tersoff, R. Martel, V. Derycke, J. Appenzeller, and P. Avouris, Phys. Rev. Lett. 89, 106801 (2002).
  10. T. Nakanishi, A. Bachtold, and C. Dekker, Phys. Rev. B 66, 073307 (2002).
  11. A. Javey, J. Guo, Q. Wang, M. Lundstrom, and H. Dai, Nature (London) 424, 654 (2003).
  12. A. Javey, J. Guo, M. Paulsson, Q. Wang, D. Mann, M. Lundstrom, and H. Dai, Phys. Rev. Lett. 92, 106804 (2004).
  13. A. Javey, J. Guo, D. B. Farmer, Q. Wang, D. Wang, R. G. Gordon, M. Lundstrom, and H. Dai, Nano Lett. 4, 447 (2004).
  14. A. Javey, J. Guo, D. B. Farmer, Q. Wang, E. Yenilmez, R. G. Gordon, M. Lundstrom, and H. Dai, Nano Lett. 4, 1319 (2004).
  15. Z. Chen, J. Appenzeller, J. Knoch, Y.-M. Lin, and P. Avouris, Nano Lett. 5, 1497 (2005).
  16. W. Kim, A. Javey, R. Tu, J. Cao, Q. Wang, and H. Dai, Appl. Phys. Lett. 87, 173101 (2005).
  17. V. Derycke, R. Martel, J. Appenzeller, and P. Avouris, Appl. Phys. Lett. 80, 2773 (2002).
  18. M. Radosavljevic, J. Appenzeller, and P. Avouris, Appl. Phys. Lett. 84, 3693 (2004).
  19. A. Javey, R. Tu, D. B. Farmer, J. Guo, R. G. Gordon, and H. Dai, Nano Lett. 5, 345 (2005).
  20. A. Bachtold, P. Hadley, T. Nakanishi, and C. Dekker, Science 294, 1317 (2001).
  21. A. Javey, Q. Wang, A. Ural, Y. Li, and H. Dai, Nano Lett. 2, 929 (2002).
  22. Y.-C. Tseng, P. Xuan, A. Javey, R. Malloy, Q. Wang, J. Bokor, and H. Dai, Nano Lett. 4, 123 (2004).
  23. K. Alam and R. Lake, Appl. Phys. Lett. 87, 073104 (2005).
  24. R. M. Stoltenberg and A. T. Woolley, Biomed. Microdevices 6, 105 (2004).
  25. K. Keren, R. S. Berman, E. Buchstab, U. Sivan, and E. Braun, Science 302, 1380 (2003).
  26. E. Braun and K. Keren, Adv. Phys. 53, 441 (2004).
  27. C. Dwyer, V. Johri, M. Cheung, J. Patwardhan, A. Lebeck, and D. Sorin, Nanotechnology 15, 1240 (2004).
  28. J. G. Fossum, M. M. Chowdhury, V. P. Trivedi, T. J. King, Y. K. Choi, J. An, and B. Yu, Tech. Dig. - Int. Electron Devices Meet. 3, 679 (2003).
  29. V. P. Trivedi, J. G. Fossum, and M. M. Chowdhury, IEEE Trans. Electron Devices 52, 56 (2005).
  30. F. B. Boeuf et al., Tech. Dig. - Int. Electron Devices Meet. 1, 637 (2001).
  31. R. Gusmeroli, A. S. Spinellit, A. Pirovano, A. L. Lacaita, E. Baeuft, and T. Skotnickit, Tech. Dig. - Int. Electron Devices Meet. 3, 225 (2003).
  32. Y.-M. Lin, J. Appenzeller, Z. Chen, Z. G. Chen, H. M. Cheng, and P. Avouris, IEEE Electron Device Lett. 26, 823 (2005).
  33. International Technology Roadmap for Semiconductors, Process Integration, Devices, and Structures, 2005 ed. (http://www.itrs.net/Common/2005ITRS/PIDS2005.pdf), p. 13.
  34. S. Heinze, M. Radosavljevic, J. Tersoff, and P. Avouris, Phys. Rev. B 68, 235418 (2003).
  35. M. Radosavljevic, S. Heinze, J. Tersoff, and P. Avouris, Appl. Phys. Lett. 83, 2435 (2003).
  36. S. J. Wind, M. Radosavljevic, J. Appenzeller, and P. Avouris, J. Vac. Sci. Technol. B 21, 2856 (2003).
  37. J. Appenzeller, J. Knoch, R. Martel, V. Derycke, S. Wind, and P. Avouris, Tech. Dig. - Int. Electron Devices Meet. 11, 285 (2002).
  38. K. Alam and R. K. Lake, J. Appl. Phys. 98, 064307 (2005).
  39. V. Eyert, J. Comput. Phys. 124, 271 (1996).
  40. J. W. Mintmire, D. H. Robertson, and C. T. White, J. Phys. Chem. Solids 54, 1835 (1993).
  41. K. Alam and R. Lake (unpublished).
  42. P. J. Burke, Solid-State Electron. 48, 1981 (2004).
  43. J. Guo, S. Hasan, A. Javey, G. Bosman, and M. Lundstrom, IEEE Trans. Nanotechnol. 4, 715 (2005).
  44. S. J. Wind, J. Appenzeller, R. Martel, V. Derycke, and P. Avouris, Appl. Phys. Lett. 80, 3817 (2002).
  45. S. Hasan, S. Salahuddin, M. Vaidyanathan, and M. A. Alam, IEEE Trans. Nanotechnol. 5, 14 (2006).
  46. R. V. Seidel et al., Nano Lett. 5, 147 (2005).
  47. B. M. Kim et al., Appl. Phys. Lett. 84, 1946 (2004).

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