Effect of oxidation on the chemical bonding structure of PECVD SiNx thin films
J. Appl. Phys. 100, 123516 (2006); doi:10.1063/1.2402581
Published 27 December 2006
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This study investigated the effect of oxidation on the chemical bonding structures of silicon nitride thin films synthesized by a low-temperature plasma-enhanced chemical vapor deposition (PECVD) method. These films were heat treated to different temperatures up to 1373 K. The bonding structures were studied by means of x-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and transmission electron microscopy. It was found that the amorphous PECVD SiNx films were subjected to oxidation in air at elevated temperatures. The oxidation caused the formation of crystalline silicon dioxide within the matrix of amorphous silicon nitride, conforming to the “random mixing” model. The crystalline silicon dioxide formed is believed to be stoichiometric SiO2, whereas the remaining matrix is believed to be a nonstoichiometric silicon oxynitride with a structure conforming to the “random bonding” model.
©2006 American Institute of Physics
| History: | Received 12 May 2006; accepted 12 October 2006; published 27 December 2006 |
| Permalink: |
http://link.aip.org/link/?JAPIAU/100/123516/1 |
KEYWORDS and PACS
silicon compounds,
oxidation,
bonds (chemical),
CVD coatings,
heat treatment,
X-ray photoelectron spectra,
Fourier transform spectra,
infrared spectra,
transmission electron microscopy,
stoichiometry,
thin films
- 68.55.Jk
Thin film structure and morphology; thickness; crystalline orientation and texture - 61.50.Lt
Crystal binding; cohesive energy - 81.40.Gh
Other heat and thermomechanical treatments - 79.60.Dp
Photoelectron spectra of adsorbed layers and thin films - 78.30.Hv
Infrared and Raman spectra in nonmetallic inorganics excluding elemental, II-VI and III-V semiconductors and fullerenes - 61.50.Nw
Crystal stoichiometry - YEAR: 2006
RELATED DATABASES
PUBLICATION DATA
0021-8979 (print)
1089-7550 (online)
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