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Systematic study of microwave absorption, heating, and microstructure evolution of porous copper powder metal compacts

J. Appl. Phys. 101, 074906 (2007); doi:10.1063/1.2713087

Published 13 April 2007 | See: Erratum

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J. Ma, J. F. Diehl, E. J. Johnson, K. R. Martin, N. M. Miskovsky, C. T. Smith, G. J. Weisel, B. L. Weiss, and D. T. Zimmerman
Altoona College, The Pennsylvania State University, 3000 Ivyside Park, Altoona, Pennsylvania 16601
We present a systematic study of the absorption, heating behavior, and microstructure evolution of porous copper powder metal compacts subjected to 2.45 GHz microwave radiation and explain our observations using known physical mechanisms. Using a single-mode microwave system, we place the compacts in pure electric (E) or magnetic (H) fields and compare the heating trends. We also investigate the effect of particle size on the same. The observed trends and the differences between E- and H-field heating are reflected in the dramatic changes in the conductivity, permittivity, and permeability of the samples. These property changes are effected by the microstructure evolution during heating in the two types of fields. We also find that the observed dependence of the initial microwave heating on particle size is suggestive of single-particle behavior. ©2007 American Institute of Physics
History: Received 26 December 2006; accepted 20 January 2007; published 13 April 2007
Permalink: http://link.aip.org/link/?JAPIAU/101/074906/1
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ERRATUM

  1. Erratum: “Systematic study of microwave absorption, heating, and microstructure evolution of porous copper powder metal” [J. Appl. Phys. 101, 074906 (2007)]
    J. Ma et al.
    J. Appl. Phys. 102, 109902 (2007)

KEYWORDS and PACS

Keywords
PACS
  • 78.70.Gq
    Microwave and radio-frequency interactions with condensed matter
  • 61.72.-y
    Defects and impurities in crystals; microstructure
  • 61.43.Gt
    Structure of powders and porous materials
  • 77.22.Ch
    Permittivity (dielectric function)
  • 75.60.Ej
    Magnetization curves, hysteresis, Barkhausen and related effects
  • YEAR: 2007

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PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
Publisher:
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REFERENCES (34)
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For access to fully linked references, you need to log in. For access to fully linked references, you need to Log in.
  1. J. D. Katz, Annu. Rev. Mater. Sci. 22, 153 (1992).
  2. J. Cheng, Y. Fang, D. K. Agrawal, Z. Wan, L. Chen, Y. Zhang, J. Zhou, X. Dong, and J. Qiu, Mater. Res. Soc. Symp. Proc. 347, 557 (1994).
  3. J. Cheng, D. K. Agrawal, S. Komarneni, M. Mathis, and R. Roy, Mater. Res. Innovations 1, 44 (1997).
  4. S. Gedevanishvili, D. K. Agrawal, and R. Roy, J. Mater. Sci. Lett. 18, 665 (1999).
  5. Yu. V. Bykov, K. I. Rybakov, and V. E. Semenov, J. Phys. D 34, R55 (2001).
  6. A. G. Whittaker, Chem. Mater. 17, 3426 (2005).
  7. R. Roy, D. K. Agrawal, J. Cheng, and S. Gedevanishvili, Nature 399, 664 (1999).
  8. J. Cheng, R. Roy, and D. Agrawal, Mater. Res. Innovations 5, 170 (2002).
  9. R. Roy, R. Peelamedu, L. Hurtt, J. Cheng, and D. Agrawal, Mater. Res. Innovations 6, 128 (2002).
  10. D. Stroud and F. P. Pan, Phys. Rev. B 17, 1602 (1978).
  11. J. Lam, J. Appl. Phys. 60, 4230 (1986).
  12. G. D. Mahan, Phys. Rev. B 38, 9500 (1988).
  13. W. T. Doyle and I. S. Jacobs, Phys. Rev. B 42, 9319 (1990).
  14. C. A. Grimes and D. M. Grimes, Phys. Rev. B 43, 10780 (1991).
  15. D. Rousselle, A. Berthault, O. Acher, J. P. Bouchaud, and P. G. Zérah, J. Appl. Phys. 74, 475 (1993).
  16. D. P. Makhnovskiy and L. V. Panina, J. Appl. Phys. 93, 4120 (2003).
  17. J. Luo, C. Hunyar, L. Feher, G. Link, M. Thumm, and P. Pozzo, Appl. Phys. Lett. 84, 5076 (2004).
  18. K. I. Rybakov, V. E. Semenov, S. V. Egorov, A. G. Eremeev, I. V. Plotnikov, and Yu. V. Bykov, J. Appl. Phys. 99, 023506 (2006).
  19. Gerling Applied Engineering, Inc., Modesto, CA 95358.
  20. R. F. Harrington, Time-Harmonic Electromagnetic Fields (IEEE: Wiley-Interscience, New York, 2001).
  21. COMSOL Multiphysics 3.2., Comsol, Inc., Burlington, MA 01803.
  22. CuLox Technologies, Inc., General Pulaski Walk, Naugatuck, CT 06770.
  23. Carver 4305.L Hydraulic Press, Carver, Inc., Wabash, IN 46992.
  24. Mikron MI-PE140, Mikron Infrared, Inc., Oakland, NJ 07436.
  25. S. Takayama, G. Link, S. Miksch, M. Sato, J. Ichikawa, and M. Thumm, Powder Metall. 49, 274 (2006).
  26. L. F. Chen, C. K. Ong, C. P. Neo, V. V. Varadan, and V. K. Varadan, Microwave Electronics: Measurement and Materials Characterization (Wiley, New York, 2004).
  27. C. M. Lynch, Senior Honors Thesis, Schreyer Honors College, Department of Physics, The Pennsylvania State University, 2006.
  28. L. Chen, C. K. Ong, and B. T. G. Tan, IEEE Trans. Instrum. Meas. 48, 1031 (1999).
  29. A. Parkash, J. K. Vaid, and A. Mansingh, IEEE Trans. Microwave Theory Tech. 27, 791 (1979).
  30. S. Li, C. Akyel, and R. G. Bossio, IEEE Trans. Microwave Theory Tech. 29, 1041 (1981).
  31. R. G. Carter, IEEE Trans. Microwave Theory Tech. 49, 918 (2001).
  32. J. Krupka, J. Eur. Ceram. Soc. 23, 2607 (2003).
  33. Hitachi S-570, Hitachi, Ltd., Tokyo Japan.
  34. Sample dissipation curve computed in Mathematica v. 4.1 using analytical solution (Wolfram Research, Inc., Champaign, IL 61820–7237).

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