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Development of pulsed laser-assisted thermal relaxation technique for thermal characterization of microscale wires

J. Appl. Phys. 103, 113505 (2008); doi:10.1063/1.2936873

Published 5 June 2008

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Jiaqi Guo,1 Xinwei Wang,2 David B. Geohegan,3 Gyula Eres,3 and Cécile Vincent4
1Department of Mechanical Engineering, N104 Walter Scott Engineering Center, The University of Nebraska-Lincoln, Lincoln, Nebraska 68588-0656, USA
2Department of Mechanical Engineering, 3027 H.M. Black Engineering Building, Iowa State University, Ames, Iowa 50011-2161, USA
3Materials Science and Technology Division and Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, 1 Bethel Valley Road, MS-6056, Oak Ridge, Tennessee 37831-6056, USA
4ICMCB, CNRS, University of Bordeaux I, 87 Avenue A. Schweitzer, 33600 Pessac, France
A transient technique is developed to measure the thermal diffusivity of one-dimensional microscale wires. In this technique, the thin wire is suspended over two copper electrodes. Upon fast (nanosecond) pulsed laser irradiation, the wire's temperature will quickly increase to a high level and then decrease gradually. Such temperature decay can be used to determine the sample's thermal diffusivity. To probe this temperature evolution, a dc is fed through the wire to sensor its voltage variation, from which the thermal diffusivity can be extracted. A 25.4  µm thin Pt wire is characterized to verify this technique. Sound agreement is obtained between the measured data and reference value. Applying this pulsed laser-assisted thermal relaxation technique, the thermal diffusivity of multiwall carbon nanotube bundles and microscale carbon fibers is measured. Detailed analysis is conducted to study the effect of the wire embedded in the paste/base on the final measurement result. ©2008 American Institute of Physics
History: Received 1 December 2007; accepted 25 March 2008; published 5 June 2008
Permalink: http://link.aip.org/link/?JAPIAU/103/113505/1
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KEYWORDS and PACS

Keywords
PACS
  • 66.30.Xj
    Thermal diffusivity
  • 66.70.-f
    Nonelectronic thermal conduction and heat-pulse propagation in solids
  • 44.10.+i
    Heat conduction
  • YEAR: 2008

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PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
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REFERENCES (17)
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