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Dispersive capacitance and conductance across the phase transition boundary in metal-vanadium oxide-silicon devices

J. Appl. Phys. 106, 034101 (2009); doi:10.1063/1.3186024

Published 3 August 2009

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Changhyun Ko and Shriram Ramanathan
Harvard School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138, USA
Utilizing metal-vanadium oxide (VO2)-semiconductor capacitor device structures, we have investigated the temperature- and frequency-dependent dielectric and ac conductance responses of vanadium oxide thin films that undergo metal-insulator transition (MIT). In both metallic and insulating regimes, VO2-based devices showed large tunabilities as high as ~95% and ~42%–54%, respectively. The frequency dependence of capacitance and ac conductance displays power-law behavior with respect to temperature and applied voltage over a broad range. Low-frequency dispersion in dielectric properties was also observed and their onset frequency varies across the MIT from ~0.5  MHz in insulating state to ~50  kHz in metallic state. The results are of potential relevance to utilizing functional oxides in electronic devices. ©2009 American Institute of Physics
History: Received 18 January 2009; accepted 27 June 2009; published 3 August 2009
Permalink: http://link.aip.org/link/?JAPIAU/106/034101/1
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KEYWORDS and PACS

Keywords
PACS
  • 84.32.Tt
    Capacitors
  • 73.40.Qv
    Electrical properties of metal-insulator-semiconductor structures
  • 71.30.+h
    Metal-insulator transitions and other electronic transitions
  • YEAR: 2009

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0021-8979 (print)   1089-7550 (online)
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REFERENCES (45)

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  1. F. J. Morin, Phys. Rev. Lett. 3, 34 (1959).
  2. A. S. Barker, Jr., H. W. Verleur, and H. J. Guggenheim, Phys. Rev. Lett. 17, 1286 (1966).
  3. L. A. Ladd and W. Paul, Solid State Commun. 7, 425 (1969).
  4. M. M. Qazilbash, M. Brehm, B. G. Chae, P. C. Ho, G. O. Andreev, B. J. Kim, S. J. Yun, A. V. Balatsky, M. B. Maple, F. Keilmann, H. T. Kim, and D. N. Basov, Science 318, 1750 (2007).
  5. N. F. Mott, Rev. Mod. Phys. 40, 677 (1968).
  6. J. B. Goodenough, J. Solid State Chem. 3, 490 (1971).
  7. T. M. Rice, H. Launois, and J. P. Pouget, Phys. Rev. Lett. 73, 3042 (1994).
  8. H. T. Kim, Y. W. Lee, B. J. Kim, B. G. Chae, S. J. Yun, K. Y. Kang, K. J. Han, K. J. Yee, and Y. S. Lim, Phys. Rev. Lett. 97, 266401 (2006).
  9. C. Ko and S. Ramanathan, J. Appl. Phys. 104, 086105 (2008).
  10. B. G. Chae, H. T. Kim, D. H. Youn, and K. Y. Kang, Physica B 369, 76 (2005).
  11. A. Cavalleri, T. Dekorsy, H. H. W. Chong, J. C. Kieffer, and R. W. Schoenlein, Phys. Rev. B 70, 161102 (2004).
  12. L. A. L. de Almeida, G. S. Deep, A. M. N. Lima, I. A. Khrebtov, V. G. Malyarov, and H. Neff, Appl. Phys. Lett. 85, 3605 (2004).
  13. J. F. Xu, R. Czerw, S. Webster, D. L. Carroll, J. Ballato, and R. Nesper, Appl. Phys. Lett. 81, 1711 (2002).
  14. M. Soltani, M. Chaker, E. Haddad, R. Kruzelecky, and J. Margot, Appl. Phys. Lett. 85, 1958 (2004).
  15. M. J. Lee, Y. Park, D. S. Suh, E. H. Lee, S. Seo, D. C. Kim, R. Jung, B. S. Kang, S. E. Ahn, C. B. Lee, D. H. Seo, Y. K. Cha, I. K. Yoo, J. S. Kim, and B. H. Park, Adv. Mater. (Weinheim, Ger.) 19, 3919 (2007).
  16. E. Tokumitsu, T. Shimamura, and H. Ishiwara, Integr. Ferroelectr. 15, 137 (1997).
  17. D. Kobayashi, T. Shibata, Y. Fujimori, T. Nakamura, and H. Takasu, IEEE Trans. Electron Devices 52, 2188 (2005).
  18. A. M. Hermann, R. M. Yandrofski, J. F. Scott, A. Naziripour, D. Galt, J. C. Price, J. Cuchario, and R. K. Ahrenkiel, J. Supercond. 7, 463 (1994).
  19. J. Im, O. Auciello, P. K. Baumann, S. K. Streiffer, D. Y. Kaufman, and A. R. Krauss, Appl. Phys. Lett. 76, 625 (2000).
  20. F. A. Miranda, G. Subramanyam, F. W. van Keuls, R. R. Romanofsky, J. D. Warner, and C. H. Mueller, IEEE Trans. Microwave Theory Tech. 48, 1181 (2000).
  21. J. Lu and S. Stemmer, Appl. Phys. Lett. 83, 2411 (2003).
  22. J. Park, J. Lu, S. Stemmer, and R. A. York, J. Appl. Phys. 97, 084110 (2005).
  23. Y. M. Poplavko, Y. V. Prokopenko, V. I. Molchanov, and A. Dogan, IEEE Trans. Microwave Theory Tech. 49, 1020 (2001).
  24. H. J. Schlag and W. Scherber, Thin Solid Films 366, 28 (2000).
  25. A. A. Bugaev, S. E. Nikitin, and E. I. Terukov, Tech. Phys. Lett. 27, 924 (2001).
  26. D. Ruzmetov, K. T. Zawilski, V. Narayanamurti, and S. Ramanathana, J. Appl. Phys. 102, 113715 (2007).
  27. C. Ko and S. Ramanathan, Appl. Phys. Lett. 93, 252101 (2008).
  28. JCPDS Card No. 01-082-0661.
  29. JCPDS Card No. 00-046-1043.
  30. D. Brassard, S. Fourmaux, M. Jean-Jacques, J. C. Kieffer, and M. A. E. Khakani, Appl. Phys. Lett. 87, 051910 (2005).
  31. R. Lopez, T. E. Haynes, L. A. Boatner, L. C. Feldman, and R. F. Haglund, Jr., Phys. Rev. B 65, 224113 (2002).
  32. J. Narayan and V. M. Bhosle, J. Appl. Phys. 100, 103524 (2006).
  33. A. K. Jonscher, Nature (London) 267, 673 (1977).
  34. K. L. Ngai, A. K. Jonscher, and C. T. White, Nature (London) 277, 185 (1979).
  35. A. K. Jonscher, J. Phys. D 32, R57 (1999).
  36. A. Tselev, C. M. Brooks, S. M. Anlage, H. Zheng, L. Salamanca-Riba, R. Ramesh, and M. A. Subramanian, Phys. Rev. B 70, 144101 (2004).
  37. E. Neagu, P. Pissis, L. Apekis, and J. L. Gomez Ribelles, J. Phys. D 30, 1551 (1997).
  38. A. von Hippel, Dielectrics and Waves (Artech House, Boston, MA, 1995).
  39. L. K. H. van Beek, Physica (Amsterdam) 26, 66 (1960).
  40. X. Yu, C. Zhu, H. Hu, A. Chin, M. F. Li, B. J. Cho, D.-L. Kwong, P. D. Foo, and M. B. Yu, IEEE Electron Device Lett. 24, 63 (2003).
  41. J. A. Babcock, S. G. Balster, A. Pinto, C. Dirnecker, P. Steinmann, R. Jumpertz, and B. El-Kareh, IEEE Electron Device Lett. 22, 230 (2001).
  42. K. S. Tan, S. Kiriaki, M. de Wit, J. W. Fattaruso, C. Y. Tsay, W. E. Matthews, and R. K. Hester, IEEE J. Solid-State Circuits 25, 1318 (1990).
  43. J. L. McCreary, IEEE J. Solid-State Circuits 16, 608 (1981).
  44. C. Kaya, H. Tigelaar, J. Paterson, M. d. Wit, J. Fattaruso, D. Hester, S. Kiriakai, K. S. Tan, and F. Tsay, IEDM Tech. Dig. 1988, 782.
  45. S. Ramanathan, D. A. Muller, G. D. Wilk, C. M. Park, and P. C. McIntyre, Appl. Phys. Lett. 79, 3311 (2001).

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