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Adhesion in organic electronic structures

J. Appl. Phys. 106, 083708 (2009); doi:10.1063/1.3246786

Published 26 October 2009

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T. Tong,1,2 B. Babatope,1,3 S. Admassie,1,4 J. Meng,1,5 O. Akwogu,1,5 W. Akande,1,2 and W. O. Soboyejo1,5
1Princeton Institute for the Science and Technology of Materials, Princeton University, Princeton, New Jersey 08544, USA
2Department of Electrical Engineering, Princeton University, Princeton, New Jersey 08544, USA
3Engineering Materials Development Institute, Km. 4 Ondo Road, P.M.B. 611, Akure, 341001 Ondo State, Nigeria
4Department of Chemistry, University of Addis-Ababa, P.O. Box 1176, Addis Ababa, Ethiopia
5Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, New Jersey 08544, USA
This paper presents the results of atomic force microscopy (AFM) measurements of the adhesion between materials relevant to organic solar cells and organic light-emitting devices. The adhesion is quantified using pull-off forces obtained for organic-organic, organic-inorganic, and inorganic-inorganic interfaces. The measured pull-off forces and surface parameters are then incorporated into theoretical models for the estimation of surface energies. The implications of the results are then discussed for the design of enhanced robustness in organic electronic structures. ©2009 American Institute of Physics
History: Received 26 June 2009; accepted 20 September 2009; published 26 October 2009
Permalink: http://link.aip.org/link/?JAPIAU/106/083708/1
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KEYWORDS and PACS

Keywords
PACS
  • 68.35.Md
    Surface thermodynamics and surface energies of solids
  • 68.35.Np
    Adhesion
  • 68.37.Ps
    Atomic force microscopy (AFM) of surfaces, interfaces and thin films
  • YEAR: 2009

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PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
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