Compressive creep behavior of an electric brush-plated nanocrystalline Cu at room temperature
J. Appl. Phys. 106, 086105 (2009); doi:10.1063/1.3247583
Published 29 October 2009
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Creep tests were conducted on a nanocrystalline Cu at room temperature. The results at very low strain rates (<4×10−8 s−1) are consistent with Coble creep. An overall view of stress-strain rate behavior of this nanocrystalline Cu indicates that as the strain rate decreases, the deformation mechanism transition from predominantly dislocation activity to diffusion Coble creep, as evidenced by the strain rate sensitivity on stress trending to m=1 and activation volume trending to
=1.5b3. The typical strain rate sensitivity of m=0.5 for surperplasticity can hardly be obtained at such low homogenous temperature.
©2009 American Institute of Physics
=1.5b3. The typical strain rate sensitivity of m=0.5 for surperplasticity can hardly be obtained at such low homogenous temperature.
©2009 American Institute of Physics
| History: | Received 20 May 2009; accepted 20 September 2009; published 29 October 2009 |
| Permalink: |
http://link.aip.org/link/?JAPIAU/106/086105/1 |
KEYWORDS and PACS
compressive strength,
copper,
diffusion creep,
dislocations,
nanostructured materials,
plasticity,
stress-strain relations
- 81.07.Bc
Nanocrystalline materials: fabrication and characterization - 61.46.Df
Structure of nanocrystals and nanoparticles - 81.40.Jj
Elasticity and anelasticity, stress-strain relations - 62.20.Hg
Creep - 81.40.Lm
Deformation, plasticity, and creep - 62.20.fq
Plasticity and superplasticity of solids - 61.72.Hh
Indirect evidence of dislocations and other defects - YEAR: 2009
RELATED DATABASES
PUBLICATION DATA
0021-8979 (print)
1089-7550 (online)
REFERENCES (20)
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- J. Karch, R. Birringer, and H. Gleiter,
Nature (London) 330, 556 (1987) . - A. H. Chokshi, A. Rosen, J. Karch, and H. Gleiter,
Scr. Metall. 23, 1679 (1989) . - R. J. Asaro and S. Suresh,
Acta Mater. 53, 3369 (2005) . - V. Yamakov, D. Wolf, M. Salazar, S. R. Phillpot, and H. Gleiter,
Acta Mater. 49, 2713 (2001) . - S. C. Tjong and H. Chen,
Mater. Sci. Eng. R. 45, 1 (2004) . - J. R. Trelewicz and C. A. Schuh, Appl. Phys. Lett. 93, 171916 (2008).
- J. Schiotz, F. D. Tolla, and K. W. Jacobsen,
Nature (London) 391, 561 (1998) . - L. Lu, M. L. Sui, and K. Lu,
Science 287, 1463 (2000) . - V. Yamakov, D. Wolf, S. R. Phillpot, and H. Gleiter,
Acta Mater. 50, 61 (2002) . - P. C. Millett, T. Desai, V. Yamakov, and D. Wolf,
Acta Mater. 56, 3688 (2008) . - B. Cai, Q. P. Kong, L. Lu, and K. Lu,
Mater. Sci. Eng., A 286, 188 (2000) . - Y. J. Li, W. Blum, and F. Breutinger,
Mater. Sci. Eng., A 387–389, 585 (2004) . - Z. Jiang, H. Zhang, C. Gu, Q. Jiang, and J. Lian, J. Appl. Phys. 104, 053505 (2008).
- R. L. Coble, J. Appl. Phys. 34, 1679 (1963).
- R. Z. Valiev, E. V. Kozlov, Yu. F. Ianov, J. Lian, A. A. Nazarov, and B. Baudelet,
Acta Metall. Mater. 42, 2467 (1994) . - W. Dickenscheid, R. Birringer, H. Gleiter, O. Kanert, B. Michel, and B. Günther,
Solid State Commun. 79, 683 (1991) . - J. Horváth, R. Birringer, and H. Gleiter,
Solid State Commun. 62, 319 (1987) . - J. Lian, C. Gu, Q. Jiang, and Z. Jiang, J. Appl. Phys. 99, 076103 (2006).
- Y. Wei, A. F. Bower, and H. Gao,
Acta Mater. 56, 1741 (2008) . - S. X. McFadden, R. S. Mishra, R. Z. Valiev, A. P. Zhilyaev, and A. K. Mukherjee,
Nature (London) 398, 684 (1999) .







