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Compressive creep behavior of an electric brush-plated nanocrystalline Cu at room temperature

J. Appl. Phys. 106, 086105 (2009); doi:10.1063/1.3247583

Published 29 October 2009

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Guoyong Wang, Jianshe Lian, Zhonghao Jiang, Liyuan Qin, and Qing Jiang
Department of Materials Science and Engineering, Key Laboratory of Automobile Materials, Jilin University, No. 5988 Renmin Street, Changchun 130025, People's Republic of China
Creep tests were conducted on a nanocrystalline Cu at room temperature. The results at very low strain rates (<4×10−8  s−1) are consistent with Coble creep. An overall view of stress-strain rate behavior of this nanocrystalline Cu indicates that as the strain rate decreases, the deformation mechanism transition from predominantly dislocation activity to diffusion Coble creep, as evidenced by the strain rate sensitivity on stress trending to m=1 and activation volume trending to upsilon=1.5b3. The typical strain rate sensitivity of m=0.5 for surperplasticity can hardly be obtained at such low homogenous temperature. ©2009 American Institute of Physics
History: Received 20 May 2009; accepted 20 September 2009; published 29 October 2009
Permalink: http://link.aip.org/link/?JAPIAU/106/086105/1
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KEYWORDS and PACS

Keywords
PACS
  • 81.07.Bc
    Nanocrystalline materials: fabrication and characterization
  • 61.46.Df
    Structure of nanocrystals and nanoparticles
  • 81.40.Jj
    Elasticity and anelasticity, stress-strain relations
  • 62.20.Hg
    Creep
  • 81.40.Lm
    Deformation, plasticity, and creep
  • 62.20.fq
    Plasticity and superplasticity of solids
  • 61.72.Hh
    Indirect evidence of dislocations and other defects
  • YEAR: 2009

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PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
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