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Compressive creep behavior of an electric brush-plated nanocrystalline Cu at room temperature
Creep tests were conducted on a nanocrystalline Cu at room temperature. The results at very low strain rates (<4×10−8 s−1) are consistent with Coble creep. An overall v...

J. Appl. Phys. / Volume 106 / Issue 8 / ERRATA

Erratum: “Effect of thermal processing on silver thin films of varying thickness deposited on zinc oxide and indium tin oxide” [ J. Appl. Phys. 105, 063525 (2009)]

J. Appl. Phys. 106, 089901 (2009); doi:10.1063/1.3262629

Published 29 October 2009

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ABSTRACT

K. Sivaramakrishnan,¹ A. T. Ngo,¹ S. Iyer,² and T. L. Alford¹
¹School of Materials and Flexible Display Center at ASU, Arizona State University, Tempe, Arizona 85287, USA
²Department of Electrical and Computer Engineering, North Carolina Agricultural and Technical State University, Greensboro, North Carolina 27411, USA

Abstract not available.

History:	Received 16 October 2009; accepted 20 October 2009; published 29 October 2009
Permalink:	http://link.aip.org/link/?JAPIAU/106/089901/1

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Effect of thermal processing on silver thin films of varying thickness deposited on zinc oxide and indium tin oxide
K. Sivaramakrishnan et al.
J. Appl. Phys. 105, 063525 (2009)