Journal of Applied Physics
Feedback | Help | Exit
Journal of Applied Physics
Search:
   
 
 
 
Previous Article
Characteristics of a micro dielectric barrier discharge ignited by a cold cathode with high ion-induced secondary electron emission for plasma display panel
We present here measurements of plasma display panel (PDP) ignited by SrO and SrCaO cold cathodes with high yield of ion-induced secondary electron emission (high i). SrO- and SrCaO-cathode PDPs attai...
Next Article
Polarimetry and Schlieren diagnostics of underwater exploding wires
Nondisturbing laser-probing polarimetry (based on the Faraday and Kerr effects) and Schlieren diagnostics were used in the investigation of underwater electrical wire explosion. Measuring the polariza...

Modeling the flux of high energy negative ions during reactive magnetron sputtering

J. Appl. Phys. 106, 093302 (2009); doi:10.1063/1.3247545

Published 4 November 2009

You are logged in to this journal.

S. Mahieu, W. P. Leroy, K. Van Aeken, and D. Depla
Department for Solid State Sciences, Ghent University, Krijgslaan 281 (S1) 9000 Ghent, Belgium
The negative ion flux during reactive sputtering from planar and rotating cylindrical magnetrons has been studied. Energy resolved mass spectrometry was used to measure the energy and mass distribution of the negative ions. Also the angular distribution of the high energy ions was characterized for planar as well as for rotating cylindrical magnetrons. Besides these measurements, a binary collision Monte Carlo simulation code, SiMTRA, was adapted in order to simulate the energy, mass, and angular distribution of the high energy negative ions. All simulated distributions, for both planar and rotating cylindrical magnetrons, were in excellent correspondence with the experimental observations. Also a model for the amount of high energy negative O− ions was proposed. Indeed, the logarithm of the amount of high energy negative O− ions is shown to be related to the secondary electron emission yield of the oxide target, and these two parameters are known to be related to the work function. The SiMTRA simulations, in combination with knowledge of the work function or secondary electron emission yield of the target, allow modeling the flux of high energy negative ions during reactive magnetron sputtering. ©2009 American Institute of Physics
History: Received 24 August 2009; accepted 15 September 2009; published 4 November 2009
Permalink: http://link.aip.org/link/?JAPIAU/106/093302/1
FULL TEXT OPTIONS   (FREE)
Download HTML Download Sectioned HTML Download PDF (240 kB) View Cart

KEYWORDS and PACS

Keywords
PACS
  • 79.20.Rf
    Atomic, molecular and ion beam impact and interactions with surfaces
  • 82.80.Ms
    Mass spectrometry (chemical analysis)
  • 79.20.Hx
    Electron-surface impact: secondary emission
  • 73.30.+y
    Surface double layers, Schottky barriers, and work functions
  • YEAR: 2009

PUBLICATION DATA

ISSN:
0021-8979 (print)   1089-7550 (online)
Publisher:
AIP is a member of CrossRef AIP

REFERENCES (35)
View in Separate Window/Tab
  1. P. H. Mayrhofer, F. Kunc, J. Musil, and C. Mitterer, Thin Solid Films 415, 151 (2002). [Inspec] [ISI]
  2. P. Patsalas, C. Gravalidis and S. Logothetidis, J. Appl. Phys. 96, 6234 (2004).
  3. S. Mahieu and D. Depla, J. Phys. D 42, 053002 (2009).
  4. J. Hahn, F. Richter, R. Pintaske, M. Röder, E. Schneider, and T. Welzel, Surf. Coat. Technol. 92, 129 (1997). [Inspec] [ISI]
  5. S. Mahieu, K. Van Aeken, and D. Depla, J. Appl. Phys. 104, 113301 (2008).
  6. L. S. Ilyinsky, B. Emmoth, E. K. Hollmann, A. G. Zaitsev, and A. A. Lavrentyev, J. Phys. D 28, 996 (1995).
  7. J. M. Ngaruiya, O. Kappertz, S. H. Mohamed, and M. Wuttig, Appl. Phys. Lett. 85, 748 (2004). [ISI]
  8. K. Tominaga and T. Kikuma, J. Vac. Sci. Technol. A 19, 1582 (2001). [ISI]
  9. S. Seeger, K. Harbauer, and K. Ellmer, J. Appl. Phys. 105, 053305 (2009).
  10. S. Mraz and J. M. Schneider, J. Appl. Phys. 100, 023503 (2006).
  11. M. Zeuner, H. Neumann, J. Zalman, and H. Bederman, J. Appl. Phys. 83, 5083 (1998). [ISI]
  12. S. Mahieu, P. Ghekiere, G. De Winter, R. De Gryse, D. Depla, and O. I. Lebedev, Solid State Phenom. 105, 447 (2005). [Inspec]
  13. S. Mahieu, W. P. Leroy, D. Depla, S. Schreiber, and W. Möller, Appl. Phys. Lett. 93, 061501 (2008).
  14. D. Depla, J. Haemers, G. Buyle, and R. De Gryse, J. Vac. Sci. Technol. A 24, 934 (2006).
  15. D. Depla, S. Heirwegh, S. Mahieu, and R. De Gryse, J. Phys. D 40, 1957 (2007).
  16. SRIM, stopping range of ions in matter, available at www.srim.org.
  17. J. B. Malherbe, S. Hoffmann, and J. M. Sanz, Appl. Surf. Sci. 27, 355 (1986). [Inspec] [ISI]
  18. D. Depla, S. Heirwegh, S. Mahieu, J. Haemers, and R. De Gryse, J. Appl. Phys. 101, 013301 (2007).
  19. K. Van Aeken, S. Mahieu, and D. Depla, J. Phys. D 41, 205307 (2008).
  20. S. Mahieu, G. Buyle, D. Depla, S. Heirwegh, P. Ghekiere, and R. De Gryse, Nucl. Instrum. Methods Phys. Res. B 243, 313 (2006). [Inspec]
  21. S. Mahieu, K. Van Aeken, and D. Depla, in Reactive Sputter Deposition, edited by D. Depla and S. Mahieu (Springer, New York, 2008), Chap. 6.
  22. M. W. Thompson, Vacuum 66, 99 (2002). [Inspec]
  23. M. H. S. Low, C. H. A. Huan, A. T. S. Wee, and K. L. Tan, Nucl. Instrum. Methods Phys. Res. B 103, 482 (1995). [Inspec] [ISI]
  24. S. Mraz and J. M. Schneider, Appl. Phys. Lett. 89, 051502 (2006).
  25. S. Mahieu and D. Depla, Appl. Phys. Lett. 90, 121117 (2007). [ISI]
  26. B. J. Garrison, N. Winograd, and D. E. Harrison, J. Vac. Sci. Technol. 16, 789 (1979). [ISI]
  27. G. Buyle, D. Depla, K. Eufinger, and R. De Gryse, J. Phys. D 37, 1639 (2004).
  28. J. M. Andersson, E. Wallen, E. P. Münger, and U. Helmersson, J. Appl. Phys. 100, 033305 (2006).
  29. R. A. Baragiola, E. V. Alonso, J. Ferron, and A. Oliva-Florio, Surf. Sci. 90, 240 (1979). [Inspec] [ISI]
  30. D. Depla, S. Mahieu, and R. De Gryse, Thin Solid Films 517, 2825 (2009). [Inspec]
  31. J. Brison, J. Guillot, B. Douhard, R. G. Vitchev, H. N. Migeon, and L. Houssiau, Nucl. Instrum. Methods Phys. Res. B 267, 519 (2009). [Inspec]
  32. M. L. Yu, Phys. Rev. Lett. 40, 574 (1978). [ISI]
  33. Q. G. Lin, X. Y. Gao, J. H. Gu, Y. S. Chen, S. E. Yang, and J. X. Lu, Chin. Phys. Lett. 25, 4223 (2008).
  34. S. Venkataraj, H. Kittur, R. Drese, and M. Wuttig, Thin Solid Films 514, 1 (2006).
  35. S. H. Mohamed, O. Kappertz, J. M. Ngaruiya, T. P. Leervad Pedersen, R. Drese, and M. Wuttig, Thin Solid Films 429, 135 (2003). [Inspec] [ISI]






Copyright © American Institute of Physics