Journal of Heat Transfer

Volume: Page/CID:

Molecular-Scale Mechanism of Thermal Resistance at the Solid-Liquid Interfaces: Influence of Interaction Parameters Between Solid and Liquid Molecules
The solid-liquid interfacial thermal resistance is getting more and more important as various solid-liquid systems are utilized in nanoscale, such as micro electro-mechanical systems/nano electro-mech...

Boundary Conditions and Evolution of Ballistic Heat Transport
We analyze the effects of boundary conditions on the evolution of ballistic heat transport in four theoretical models and propose that a Fourier equation with an effective size-dependent thermal condu...

J. Heat Transfer / Volume 132 / Issue 1 / Research Papers / Micro/Nanoscale Heat Transfer

Measurement of the Heat Capacity of Copper Thin Films Using a Micropulse Calorimeter

J. Heat Transfer -- January 2010 -- Volume 132, Issue 1, 012403 (6 pages)
doi:10.1115/1.3211864

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ABSTRACT

REFERENCES (39)

Author(s):
Jun Yu, Zhen'an Tang, Fengtian Zhang, Haitao Ding, and Zhengxing Huang
Department of Electronic Engineering, Dalian University of Technology, Dalian, Liaoning 116024, China

Thispaper presents a micropulse calorimeter for heat capacity measurement ofthin films. Optimization of the structure and data processing methodsof the microcalorimeter improved the thermal isolation and temperature uniformityand reduced the heat capacity measurement errors. Heat capacities ofcopper thin films with thicknesses from 20 nm to 340nm are measured in the temperature range from 300 Kto 420 K in vacuum of 1 mPa. The specificheat of the 340 nm Cu film is close tothe literature data of bulk Cu. For the thinner films,the data shows that the specific heat increases with thedecreasing of film thickness (or the average crystalline size).