Skip navigation.

  ASMEDL.ORG »  Journals »  J. Heat Transfer »  Volume 132 »  pp. 32401
Adjust text size: Decrease font size Increase font size

Journal of Heat Transfer
Volume: Page/CID:

Previous Article
Computational Analysis of Pin-Fin Arrays Effects on Internal Heat Transfer Enhancement of a Blade Tip Wall
Cooling methods are strongly needed for the turbine blade tips to ensure a long durability and safe operation. Improving the internal convective cooling is therefore required to increase the blade tip...
Next Article
Ultra-Low Thermal Conductivity in Nanoscale Layered Oxides
The cross-plane thermal conductivity of several nanoscale layered oxides SiO2/Y2O3, SiO2/Cr2O3, and SiO2/Al2O3, synthesized by e-beam evaporation was measured in the range from 30 K to 300 K by the 3 ...

Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

J. Heat Transfer  -- March 2010 --  Volume 132,  Issue 3, 032401 (10 pages)
doi:10.1115/1.4000047

You are not logged into the ASME Digital Library.
Log in

Author(s):
Tengfei Luo
Department of Mechanical Engineering, Michigan State University, 2555 Engineering Building, East Lansing, MI 48824

John R. Lloyd
ASFC 1.316.C RRMC, Rapid Response Manufacturing Center, University of Texas Pan American, Edinburg, TX 78539
In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) molecules. The out-of-plane (z-direction) thermal conductance and in-plane (x- and y-direction) thermal conductivities were calculated. The simulation finite size effect, gold substrate thickness effect, temperature effect, normal pressure effect, molecule chain length effect, and molecule coverage effect on thermal conductivity/conductance were studied. Vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM were calculated, and vibration coupling of these two parts was analyzed. The calculated thermal conductance values of Au-SAM-Au junctions are in the range of experimental data on metal-nonmetal junctions. The temperature dependence of thermal conductance has a similar trend to experimental observations. It is concluded that the Au-SAM interface resistance dominates thermal energy transport across the junction, while the substrate is the dominant media in which in-plane thermal energy transport happens.

©2010 American Society of Mechanical Engineers

History: Received 13 November 2008; revised 14 August 2009; published 22 December 2009
doi: http://dx.doi.org/10.1115/1.4000047

KEYWORDS and PACS

Keywords
PACS
  • 44.10.+i
    Heat conduction
  • 61.43.Bn
    Structural modeling of disordered solids
  • 66.70.Lm
    Nonelectronic thermal conduction and heat-pulse propagation in other solids
  • YEAR: 2010

RELATED DATABASES


To view database links for this article,
you need to log in.
To view database links for this article,
you need to log in.

PUBLICATION DATA

Coden:
JHTRAO
ISSN:
0022-1481 (print)   1528-8943 (online)
Publisher:
AIP is a member of CrossRef ASME

REFERENCES (48)

For access to fully linked references, you need to log in. For access to fully linked references, you need to Log in.

CITING ARTICLES

For access to citing articles, you need to log in.
For access to citing articles, you need to Log in.