Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions
In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) mol...
In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol (–S–(CH2)n–S–) mol...
Investigations on Multimode Heat Transfer From a Heated Vertical Plate
The interaction of surface radiation and conduction with natural convection heat transfer from a vertical flat plate assembly, with an embedded heater, has been investigated, both experimentally (usin...
The interaction of surface radiation and conduction with natural convection heat transfer from a vertical flat plate assembly, with an embedded heater, has been investigated, both experimentally (usin...
Ultra-Low Thermal Conductivity in Nanoscale Layered Oxides
J. Heat Transfer -- March 2010 -- Volume 132, Issue 3, 032402 (6 pages)
doi:10.1115/1.4000052
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The cross-plane thermal conductivity of several nanoscale layered oxides SiO2/Y2O3, SiO2/Cr2O3, and SiO2/Al2O3, synthesized by e-beam evaporation was measured in the range from 30 K to 300 K by the 3
method. Thermal conductivity attains values around 0.5 W/m K at room temperature in multilayer samples, formed by 20 bilayers of 10 nm SiO2/10 nm Y2O3, and as low as 0.16 W/m K for a single bilayer. The reduction in thermal conductivity is related to the high interface density, which produces a strong barrier to heat transfer rather than to the changes of the intrinsic thermal conductivity due to the nanometer thickness of the layers. We show that the influence of the first few interfaces on the overall thermal resistance is higher than the subsequent ones. Annealing the multilayered samples to 1100°C slightly increases the thermal conductivity due to changes in the microstructure. These results suggest a route to obtain suitable thermal barrier coatings for high temperature applications.
method. Thermal conductivity attains values around 0.5 W/m K at room temperature in multilayer samples, formed by 20 bilayers of 10 nm SiO2/10 nm Y2O3, and as low as 0.16 W/m K for a single bilayer. The reduction in thermal conductivity is related to the high interface density, which produces a strong barrier to heat transfer rather than to the changes of the intrinsic thermal conductivity due to the nanometer thickness of the layers. We show that the influence of the first few interfaces on the overall thermal resistance is higher than the subsequent ones. Annealing the multilayered samples to 1100°C slightly increases the thermal conductivity due to changes in the microstructure. These results suggest a route to obtain suitable thermal barrier coatings for high temperature applications.
©2010 American Society of Mechanical Engineers
| History: | Received 21 February 2009; revised 27 July 2009; published 28 December 2009 | |
| doi: | http://dx.doi.org/10.1115/1.4000052 | |
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