Differential etching behavior between semi-insulating and n-doped 4H-SiC in high-density SF6/O2 inductively coupled plasma
The author investigated the etching characteristics of semi-insulating (SI) and n-doped (n-) 4H-SiC substrates at a high etch rate of about 2 µm/min using high-density SF6/O2 inductiv...
Inductively coupled plasma generator for an environmentally benign perfluorocarbon abatement system
Although conventional plasma-resolution-type abatement systems for perfluorocarbons (PFCs) achieve PFC removal efficiencies of more than 98%, they consume a lot of electricity. To diminish global warm...