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MARS: Femtosecond laser mask advanced repair system in manufacturing

J. Vac. Sci. Technol. B Volume 17, Issue 6, pp. 3137-3143 (November 1999)

Issue Date: November 1999
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KEYWORDS and PACS

Keywords
PACS
  • 85.40.Hp
    Electronic and magnetic devices; microelectronics Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology Lithography, masks and pattern transfer
  • 61.80.Ba
    Structure of solids and liquids; crystallography Physical radiation effects, radiation damage Ultraviolet, visible, and infrared radiation effects (including laser radiation)
  • 42.62.Cf
    Optics Laser applications Industrial applications
  • YEAR: 1999

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PUBLICATION DATA

ISSN:
1071-1023 (print)   1520-8567 (online)
Publisher:
AIP is a member of CrossRef AVS
Richard Haight
IBM T. J. Watson Research Center, Yorktown Heights, New York 10598

Dennis Hayden
IBM Microelectronics Division, Essex Junction, Vermont 05452

Peter Longo
IBM T. J. Watson Research Center, Yorktown Heights, New York 10598

Timothy Neary
IBM Microelectronics Division, Essex Junction, Vermont 05452

Alfred Wagner
IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
Presently available nanosecond laser based tools for removing Cr defects from photomasks have proven inadequate to the task due to the thermal nature of the ablation process which produces metal splatter, haze, reduced transmission, and pitting of the quartz substrate. These problems are virtually nonexistent when employing femtosecond pulses of light to ablate Cr defects in a nonthermal process. Photomasks repaired with ultrashort light pulses exhibit transmission approaching 100%, no observable glass damage, and exceptional spatial resolution. We have built a femtosecond pulsed laser mask repair system which is presently operating successfully in a manufacturing environment. ©1999 American Vacuum Society.
History: Received 1 June 1999; accepted 17 September 1999
Permalink: http://dx.doi.org/10.1116/1.590968

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