Temperature Evolution of Spin Relaxation in a NiFe/Cu Lateral Spin Valve

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T. Kimura,^1,2 T. Sato,¹ and Y. Otani^1,2
¹Institute for Solid State Physics, University of Tokyo, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8581, Japan
²RIKEN FRS, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan

Received 26 September 2007; published 13 February 2008

Temperaturedependence of spin relaxation process in a Cu wire hasbeen studied by means of nonlocal spin-valve measurements. The spin-diffusionlength of the Cu wire is found to take maximumat the characteristic temperature, below which the spin-diffusion length isreduced. The mechanism of the reduction can be explained byconsidering the spin-flip scattering due to the oxidized surface ofthe Cu wire. The thickness dependence of the characteristic temperaturesupports the interpretation with the surface oxidation.

URL:	http://link.aps.org/doi/10.1103/PhysRevLett.100.066602
DOI:	10.1103/PhysRevLett.100.066602
PACS:	72.25.Ba; 72.25.Mk; 75.70.Cn; 75.75.+a 72.25.Ba Spin polarized transport in metals 72.25.Mk Spin transport through interfaces 75.70.Cn Magnetic properties of interfaces 75.75.+a Magnetic properties of nanostructures YEAR: 2008

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